Patents by Inventor Thomas M. Duddy

Thomas M. Duddy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat exchanger apparatus for a semiconductor wafer support and method of fabricating same
    Patent number: 6449844
    Abstract: A heat exchanger apparatus including a heat exchange element and a substrate support. A clamp member is coupled to the heat exchange element and the substrate support by expanding the clamp member to an expanded state sufficient to surround a portion of the substrate support and the heat exchange element, and contracting the clamp member to couple the clamp member to the substrate support.
    Type: Grant
    Filed: December 5, 2000
    Date of Patent: September 17, 2002
    Assignee: Applied Materials, Inc.
    Inventors: Thomas M. Duddy, Robin M. Ellis, Craig A. Bercaw
  • Heat exchanger apparatus for a semiconductor wafer support and method of fabricating same
    Publication number: 20010040157
    Abstract: A heat exchanger apparatus including a heat exchange element and a substrate support. A clamp member is coupled to the heat exchange element and the substrate support by expanding the clamp member to an expanded state sufficient to surround a portion of the substrate support and the heat exchange element, and contracting the clamp member to couple the clamp member to the substrate support.
    Type: Application
    Filed: December 5, 2000
    Publication date: November 15, 2001
    Inventors: Thomas M. Duddy, Robin M. Ellis, Craig A. Bercaw
  • Heat exchanger apparatus for a semiconductor wafer support and method of fabricating same
    Patent number: 6180926
    Abstract: A heat exchanger apparatus including a heat exchange element and a substrate support. A clamp member is coupled to the heat exchange element and the substrate support by expanding the clamp member to an expanded state sufficient to surround a portion of the substrate support and the heat exchange element, and contracting the clamp member to couple the clamp member to the substrate support.
    Type: Grant
    Filed: October 19, 1998
    Date of Patent: January 30, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Thomas M. Duddy, Robin M. Ellis, Craig A. Bercaw