Abstract: A boom for an earth-moving machine, in particular an excavator, comprising rear and front boom parts that are cohesively assembled to form a boomerang-like boom structure, wherein the central connection between the boom parts is formed by a simple thick central connecting plate.

Abstract: The present invention relates to a boom for an earth-moving machine, in particular an excavator, with at least two bearing plates for supporting a cylinder unit, which at least for the most part extend parallel to each other in the longitudinal direction of the boom, wherein the bearing plates have an end-side curvature extending outwardly to the lateral edge of the boom.

Abstract: The present invention relates to a boom for an earth-moving machine, in particular an excavator, comprising rear and front boom parts that are cohesively assembled to form a boomerang-like boom structure, wherein the central connection between the boom parts is formed by a simple thick central connecting plate.

Abstract: The present invention relates to a boom for an earth-moving machine, in particular an excavator, with at least two bearing plates for supporting a cylinder unit, which at least for the most part extend parallel to each other in the longitudinal direction of the boom, wherein the bearing plates have an end-side curvature extending outwardly to the lateral edge of the boom.

Abstract: Provided is a fermentation process wherein green ripe uncured vanilla beans are incubated with [microbes] bacillus subtilis in isolated form to convert glucovanillin to vanillin while consistently forming a fully developed well-balanced vanilla aroma without off-notes.

Abstract: Provided is a fermentation process wherein green ripe uncured vanilla beans are incubated with bacillus subtilis in isolated form to convert glucovanillin to vanillin while consistently forming a fully developed well-balanced vanilla aroma without off-notes.

Abstract: Provided is a fermentation process wherein green ripe uncured vanilla beans are incubated with [microbes] bacillus subtilis in isolated form to convert glucovanillin to vanillin while consistently forming a fully developed well-balanced vanilla aroma without off-notes.

Abstract: A circuit support for a semiconductor chip with a substrate made of an insulating material has a chip mounting area and a plurality of bonding pads surrounding the chip mounting area. The chip can be applied in a central area of the chip mounting area. A peripheral area surrounding the central area defines the border of the chip mounting area and it is of a far greater length than a length of the lateral edges of the chip to be mounted.

Abstract: A circuit carrier includes a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.

Abstract: A circuit carrier includes a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.

Abstract: The invention relates to a circuit carrier and a method for producing it, the circuit carrier having a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.

Abstract: The invention relates to a circuit carrier and a method for producing it, the circuit carrier having a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.

Abstract: In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

Abstract: A modularly expandable semiconductor component includes at least one carrier layer, at least one intermediate layer, at least one coverlayer, at least one semiconductor chip, external contacts and a conductor configuration. The intermediate layer is provided with at least one opening, into which the at least one semiconductor chip is inserted. The carrier layer, the intermediate layer and the coverlayer are connected one above another and form a submodule. If a plurality of submodules are installed above one another, a semiconductor component is provided in which the semiconductor chips are located in several mutually overlying planes. The semiconductor chips can be interconnected. A method for producing a semiconductor component is also provided.

Abstract: In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

Abstract: The transport device for electronic components is formed with at least one recess to accommodate an electronic component. In order to protect the component, the recess is provided with an anticontamination coating.

Abstract: The invention relates to an electronic device having a multiplicity of contact bumps and an intermediate support. In this case, the intermediate support connects the multiplicity of contact bumps to contact areas of a semiconductor chip via a multiplicity of flat conductors which have contact connecting lugs exposed in a bonding channel window of the intermediate support. The contact areas are configured in the bonding channel window via the bonded contact connecting lugs of the flat conductors. The width of the bonding channel window is increasingly greater with increasing distance from the neutral point of the semiconductor chip.

Abstract: A method for COB mounting of electronic chips on a circuit board includes contact connection of connecting wires and substantially whole-area adhesive bonding of a housing. A chip is partially adhesively bonded on a circuit board in such a way that the chip can be contact-connected and can be removed again without damage to the circuit board. Electronic tests or a burn-in process is performed on the chip. The chip, with a given functionality in a manner that is required for application of the circuit board, is fully adhesively bonding.

Abstract: An orthopedic device comprises a shaft capable of at least partially encircling at least a lower part of a leg, a foot part, a cup-shaped heel part connecting the foot part to the shaft, a continuous bearing surface arranged between the front end of the foot part and the heel part, the bearing surface constituting a lower closure of the orthopedic device and having a side facing the interior of the orthopedic device, which is flat and symmetrical with respect to a central longitudinal axis, and an arch support affixable to said bearing surface side. A portion of the arch support running along an outside of a foot capable of being supported by the arch support extends substantially horizontally, and a portion of the arch support running along an inside of the foot has a shape of a rising arc, a flank of the arc near the heel rising substantially perpendicularly from the bearing surface to an apex and extending from the apex to the foot part.