Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.

Abstract: Apparatus and methods are provided for integrally packaging antennas with semiconductor IC (integrated circuit) chips to provide highly-integrated and high-performance radio/wireless communications systems for millimeter wave applications including, e.g., voice communication, data communication, and radar applications. For example, wireless communication modules are constructed with IC chips having receiver/transmitter/transceiver integrated circuits and planar antennas that are integrally constructed from BEOL (back end of line) metallization structures of the IC chip.

Abstract: Apparatus and methods are provided for integrally packaging antennas with semiconductor IC (integrated circuit) chips to provide highly-integrated and high-performance radio/wireless communications systems for millimeter wave applications including, e.g., voice communication, data communication, and radar applications. For example, wireless communication modules are constructed with IC chips having receiver/transmitter/transceiver integrated circuits and planar antennas that are integrally constructed from BEOL (back end of line) metallization structures of the IC chip.

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.

Abstract: Apparatus and methods are provided for integrally packaging antenna devices with semiconductor IC (integrated circuit) chips, wherein IC chips are packaged with dielectric resonators antennas that are integrally constructed as part of a package molding (encapsulation) process, for example, to form compact integrated radio/wireless communications systems for millimeter wave applications.

Abstract: Apparatus and methods are provided for constructing waveguide-to-transmission line transitions that provide broadband, high performance coupling of power at microwave and millimeter wave frequencies. More specifically, exemplary embodiments of the invention include wideband, low-loss and compact coplanar waveguide-to-rectangular waveguide transition structures and asymmetric coplanar stripline (or coplanar stripline)-to-rectangular waveguide transition structures that are particularly suitable for microwave and millimeter wave applications.

Abstract: Apparatus and methods are provided for integrally packaging antennas with semiconductor IC (integrated circuit) chips to provide highly-integrated and high-performance radio/wireless communications systems for millimeter wave applications including, e.g., voice communication, data communication and radar applications. For example, wireless communication modules are constructed with IC chips having receiver/transmitter/transceiver integrated circuits and planar antennas that are integrally constructed from BEOL (back end of line) metallization structures of the IC chip.

Abstract: An ultra-broadband balun is provided. The balun comprises: a first unbalanced transmission line comprising a first ground trace and a signal trace; and a balanced transmission line comprising a first and second signal trace, wherein the first signal trace of the balanced transmission line is connected to the first ground trace of the first unbalanced transmission line and the second signal trace of the balanced transmission line is connected to the signal trace of the first unbalanced transmission line, wherein a first capacitor is disposed in series with one of the first ground trace of the first unbalanced transmission line and the first signal trace of the balanced transmission line.

Abstract: A direct current (DC) isolated phase inverter and a ring hybrid coupler including the DC isolated phase inverter is provided. The ring hybrid coupler including the DC isolated phase inverter comprising: a first, second, third and fourth transmission line arm; a first port connected to the first arm, second port connected to the second arm, third port connected to the third arm and fourth port connected to the fourth arm; and a DC phase inverter inserted within one of the first, second, third and fourth arms, wherein the DC phase inverter comprises: a transmission line comprising a plurality of signal and ground traces, wherein the plurality of signal and ground traces are interchanged; and a plurality of capacitors disposed in series with the ground traces, wherein the plurality of capacitors isolate the DC phase inverter from a device connected to the transmission line.