Patents by Inventor Thomas Marinis

Thomas Marinis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and system for suspending a chip-scale device and related methods
    Patent number: 7215213
    Abstract: A suspension of a chip-scale device is accomplished using a suspension frame and at least one first tether. The chip-scale suspension frame defines a first plane and an opening through the suspension frame. At least one first tether crosses the opening at a first angle relative to the first plane and can be used to position the chip-scale device at least partially within the opening.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: May 8, 2007
    Assignee: Charles Stark Draper Laboratory, Inc., The
    Inventors: Mark J. Mescher, Mathew Varghese, Marc Steven Weinberg, Thomas Marinis, Joseph W. Soucy
  • Apparatus and system for suspending a chip-scale device and related methods
    Publication number: 20060051883
    Abstract: A suspension of a chip-scale device is accomplished using a suspension frame and at least one first tether. The chip-scale suspension frame defines a first plane and an opening through the suspension frame. At least one first tether crosses the opening at a first angle relative to the first plane and can be used to position the chip-scale device at least partially within the opening.
    Type: Application
    Filed: July 13, 2005
    Publication date: March 9, 2006
    Inventors: Mark Mescher, Mathew Varghese, Marc Weinberg, Thomas Marinis, Joseph Soucy
  • Sensor isolation system
    Publication number: 20050258525
    Abstract: A sensor isolation system including a sensor, a package for the sensor, and a compliant interposer disposed between the sensor and the package and interconnecting the sensor to the package to isolate the sensor from thermal and mechanical stresses and yet at the same time providing a physical interconnect between the sensor and the package.
    Type: Application
    Filed: June 21, 2005
    Publication date: November 24, 2005
    Inventors: Richard Anderson, David Hanson, Frederick Kasparian, Thomas Marinis, Joseph Soucy
  • Integrated sensor and electronics package
    Publication number: 20050199971
    Abstract: An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input/output connections on the package substrate are electrically connected to one or more of the electronic chips.
    Type: Application
    Filed: February 15, 2005
    Publication date: September 15, 2005
    Inventors: Richard Anderson, James Connelly, David Hanson, Joseph Soucy, Thomas Marinis