Abstract: An apparatus and method to cool compressors, condensing coils, and similar devices. The compressor or condensing coil is cooled by the delivery of water, which may be ambient temperature or chilled. In one embodiment, the water is delivered to a mesh filter or screen via one or more mist spray nozzles. Water conduits may be integrated with the filter frame. The method to control the delivery of the water is designed to conserve water. The control circuit comprises a microcontroller device which contains programming that receives inputs, including but not limited to, outside ambient air temperature, condenser liquid line temperature, relative humidity and electric current, and uses said inputs to provide a stepwise level of control (“solenoid open time”) of water delivery commensurate with outside air temperature and relative humidity.

Abstract: An apparatus and method to cool compressors, condensing coils, and similar devices. The compressor or condensing coil is cooled by the delivery of water, which may be ambient temperature or chilled. In one embodiment, the water is delivered to a mesh filter or screen via one or more mist spray nozzles. Water conduits may be integrated with the filter frame. The method to control the delivery of the water is designed to conserve water. The control circuit comprises a microcontroller device which contains programming that receives inputs, including but not limited to, outside ambient air temperature, condenser liquid line temperature, relative humidity and electric current, and uses said inputs to provide a stepwise level of control (“solenoid open time”) of water delivery commensurate with outside air temperature and relative humidity.

Abstract: An apparatus and method to cool compressors, condensing coils, and similar devices. The compressor or condensing coil is cooled by the delivery of water, which may be ambient temperature or chilled. In one embodiment, the water is delivered to a mesh filter or screen via one or more mist spray nozzles. Water conduits may be integrated with the filter frame. The method to control the delivery of the water is designed to conserve water. The control circuit comprises a microcontroller device which contains programming that receives inputs, including but not limited to, outside ambient air temperature, condenser liquid line temperature, relative humidity and electric current, and uses said inputs to provide a stepwise level of control (“solenoid open time”) of water delivery commensurate with outside air temperature and relative humidity.

Abstract: An apparatus and method to cool compressors, condensing coils, and similar devices. The compressor or condensing coil is cooled by the delivery of water, which may be ambient temperature or chilled. In one embodiment, the water is delivered to a mesh filter or screen via one or more mist spray nozzles. Water conduits may be integrated with the filter frame. The method to control the delivery of the water is designed to conserve water. The control circuit comprises a microcontroller device which contains programming that receives inputs, including but not limited to, outside ambient air temperature, condenser liquid line temperature, relative humidity and electric current, and uses said inputs to provide a stepwise level of control (“solenoid open time”) of water delivery commensurate with outside air temperature and relative humidity.

Abstract: A suspension of a chip-scale device is accomplished using a suspension frame and at least one first tether. The chip-scale suspension frame defines a first plane and an opening through the suspension frame. At least one first tether crosses the opening at a first angle relative to the first plane and can be used to position the chip-scale device at least partially within the opening.

Abstract: A suspension of a chip-scale device is accomplished using a suspension frame and at least one first tether. The chip-scale suspension frame defines a first plane and an opening through the suspension frame. At least one first tether crosses the opening at a first angle relative to the first plane and can be used to position the chip-scale device at least partially within the opening.

Abstract: A sensor isolation system including a sensor, a package for the sensor, and a compliant interposer disposed between the sensor and the package and interconnecting the sensor to the package to isolate the sensor from thermal and mechanical stresses and yet at the same time providing a physical interconnect between the sensor and the package.

Abstract: An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input/output connections on the package substrate are electrically connected to one or more of the electronic chips.