Abstract: A method for making an electronic product. The method includes processing a flexible substrate (e.g., a web) with the use of a tensioner having a vacuum plate and an indexer that intermittently moves the flexible substrate for processing. While a designated location of the flexible substrate is stopped at a processing location, a process is performed on the designated location. Wherein while the designated location is stopped at the processing location, the vacuum plate of the tensioner moves in an opposite direction of the transport direction.

Abstract: A method for making an electronic product. The method includes processing a flexible substrate (e.g., a web) with the use of a tensioner having a vacuum plate and an indexer that intermittently moves the flexible substrate for processing. While a designated location of the flexible substrate is stopped at a processing location, a process is performed on the designated location. Wherein while the designated location is stopped at the processing location, the vacuum plate of the tensioner moves in an opposite direction of the transport direction.

Abstract: In a chip transferring apparatus a wafer (44) and a lead frame (50) are positioned. A first chip (42) is picked up from the wafer (44) by a transfer head (14; 40a-40d) in a chip pick-up position, while bonding a second chip to the lead frame (50) by another transfer head in a chip bonding position. The first chip (42) is then transferred by said one of the transfer heads from the chip pick-up position to the chip bonding position. Next, the first chip (42) is bonded on the lead frame (50) by said one of the transfer heads (14; 40a-40d) in the chip bonding position, while another one of the transfer heads picks up a third chip from the wafer (44) in the chip pick-up position. Each transfer head (14; 40a-40d) comprises a collet (66a-66d) which, through a mechanical coupling, is coupled to another collet for compensating radial forces exerted on the collet relative to said axis of rotation.

Abstract: A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.

Abstract: A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.