Patents by Inventor Thomas Matthew CUMMINS

Thomas Matthew CUMMINS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MODULAR PIEZOELECTRIC SENSOR ARRAY WITH CO-INTEGRATED ELECTRONICS AND BEAMFORMING CHANNELS
    Publication number: 20220079559
    Abstract: A modular array includes modular array includes one or more array modules. Each array module includes one or more transducer arrays, where each of the one or more transducer arrays includes a plurality of piezoelectric elements; a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays; and one or more Application Specific Integrated Circuits (ASICs). The conducting interposer and the one or more ASICs are in electrical contact with each other at a first direct electrical interface. Additionally, the conducting interposer and the one or more transducer arrays are in electrical contact with each other at a second direct electrical interface.
    Type: Application
    Filed: August 31, 2021
    Publication date: March 17, 2022
    Applicants: University of Southern California, The Regents of the University of California
    Inventors: Robert G. Wodnicki, Qifa Zhou, Thomas Matthew Cummins, Douglas N. Stephens, Katherine W. Ferrara
  • Modular piezoelectric sensor array with co-integrated electronics and beamforming channels
    Patent number: 11134918
    Abstract: A modular array includes modular array includes one or more array modules. Each array module includes one or more transducer arrays, where each of the one or more transducer arrays includes a plurality of piezoelectric elements; a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays; and one or more Application Specific Integrated Circuits (ASICs). The conducting interposer and the one or more ASICs are in electrical contact with each other at a first direct electrical interface. Additionally, the conducting interposer and the one or more transducer arrays are in electrical contact with each other at a second direct electrical interface.
    Type: Grant
    Filed: February 18, 2017
    Date of Patent: October 5, 2021
    Assignees: University of Southern California, The Regents of the University of California
    Inventors: Robert G. Wodnicki, Qifa Zhou, Thomas Matthew Cummins, Douglas N. Stephens, Katherine W. Ferrara
  • MODULAR PIEZOELECTRIC SENSOR ARRAY WITH CO-INTEGRATED ELECTRONICS AND BEAMFORMING CHANNELS
    Publication number: 20200046320
    Abstract: A modular array includes modular array includes one or more array modules. Each array module includes one or more transducer arrays, where each of the one or more transducer arrays includes a plurality of piezoelectric elements; a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays; and one or more Application Specific Integrated Circuits (ASICs). The conducting interposer and the one or more ASICs are in electrical contact with each other at a first direct electrical interface. Additionally, the conducting interposer and the one or more transducer arrays are in electrical contact with each other at a second direct electrical interface.
    Type: Application
    Filed: February 18, 2017
    Publication date: February 13, 2020
    Applicants: University of Southern California, Regents of the University of California, Daavis
    Inventors: Robert G. WODNICKI, Qifa ZHOU, Thomas Matthew CUMMINS, Douglas N. STEPHENS, Katherine W. FERRARA