Abstract: A device for connecting communications networks has a safety switch with which two communications networks present in the motor vehicle may be connected by a user. In this connection, in particular, a multimedia network having an air interface, preferably implemented by a mobile phone, is connected to a safety network to which vehicle components are connected that are critical to safety. This connection becomes necessary when a remote diagnosis of the vehicle components or a software update is to be undertaken.

Abstract: A device for receiving data via radio signals in a motor vehicle, where a single operation of an input means putting the device in a state, stored in the memory, for playback of the data. As a result, when confronted with an apparently hopeless situation, a user in a motor vehicle, in the simplest of operations and without being distracted from driving activities, is able to return the device to a state where it may be optimally utilized. Various input devices are possible here, such as a pushbutton, a remote control or a microphone. The state may be characterized by various selection options, including resumption of data reception from a service, resumption of a service used previously, returning to a portal of a service provider or restarting the device, in which case the restart may be performed either through hardware or software. A pushbutton may cause various states of the device, depending on the length of time of operation of the pushbutton.

Abstract: A method for attaching an electronic device to and removing an electronic device from a substrate includes verifying a position of a pick-up and vacuum head relative to the electronic device prior to contacting the electronic device with the pick-up and vacuum head; contacting the electronic device with a device for conductively applying heat to the electronic device and picking up the electronic device; and heating solder for attaching the electronic device to the substrate to a reflow temperature of the solder by applying heat to the device for conductively applying heat.

Abstract: A solder interconnection between a module and printed circuit board or card is provided by a plurality of solder connections arranged in a micro grid array joining solder wettable pads on a major surface of the module to a corresponding set of solder wettable pads of the printed circuit board or card. The solder connections are column shaped with the height of each connection being at least about 1.4 times the diameter of the connection.

Abstract: A solder interconnection between a module and printed circuit board or card is provided by a plurality of solder connections arranged in a micro grid array joining solder wettable pads on a major surface of the module to a corresponding set of solder wettable pads of the printed circuit board or card. The solder connections are column shaped with the height of each connection being at least about 1.4 times the diameter of the connection.

Abstract: A solder interconnection between a module and printed circuit board or card is provided by a plurality of solder connections arranged in a micro grid array joining solder wettable pads on a major surface of the module to a corresponding set of solder wettable pads of the printed circuit board or card. The solder connections are column shaped with the height of each connection being at least about 1.4 times the diameter of the connection.

Abstract: Electrostatic Discharge (ESD) protection scheme includes a divided rail structure to route damaging ESD away from sensitive circuitry. Specifically, Vdd and Vss rails are divided to segregate the ESD current within a circuit, thus isolating the sensitive circuitry from ESD exposure. In an exemplary embodiment, Vdd is divided into Vdd-esd and Vdd core, while Vss is divided into Vss-esd and Vss core. The structure in cooperation with diodes, clamps and resistors enables to isolate the rails (Vdd core and Vss core) associated with sensitive circuitry from ESD current.

Abstract: A non-aqueous rinsing medium is disclosed, and a process for using same as a rinsing agent in a process for spray-coating of mass-produced substrates (such as automobile bodies) with frequent changes between at least one aqueous and at least one non-aqueous coating agent inside a spray-coating chamber, wherein with at least each change of coating agent the installations to be rinsed are rinsed automatically with the non-aqueous rinsing medium consisting of (a) 20 to 35% by weight of one or more N-alkyl pyrrolidones, (b) 20 to 35% by weight of butyl acetate and/or isobutyl acetate, (c) 10 to 20% by weight of one or more glycol ethers, which are water-miscible without miscibility gap, (d) 5 to 15% by weight of ethanol, propanol and/or isopropanol, (e) 10 to 20% by weight of one or more aliphatic C4-C7-ketones, (f) 0 to 5% by weight of one or more organic solvents conventionally used in coating agents, and (g) 0 to 5% by weight of one or more auxiliary agents, whereby components (a), (c) and (d) comprise

Abstract: An apparatus for attaching an electronic device to and removing an electronic device from a substrate. An electronic device pick-up and vacuum head applies a vacuum source to the electronic device for engaging, picking up and retaining the electronic device. The heat is transmitted by conduction through the structure of the device pick-up and vacuum head to the electronic device and solder for securing the electronic device on the substrate to heat the solder to its reflow temperature. The pick-up and vacuum head includes an electronic device engaging portion, a vacuum port, and a heat source engaging portion.

Abstract: An apparatus for attaching an electronic device to and removing an electronic device from a substrate. An electronic device pick-up and vacuum head applies a vacuum source to the electronic device for engaging, picking up and retaining the electronic device. The heat is transmitted by conduction through the structure of the device pick-up and vacuum head to the electronic device and solder for securing the electronic device on the substrate to heat the solder to its reflow temperature. The pick-up and vacuum head includes an electronic device engaging portion, a vacuum port, and a heat source engaging portion.

Abstract: A multiple force tool for applying pressure to circuit components during a manufacturing operation. A plurality of compressed air pressure cylinders are supported on a plurality of horizontal arms over a circuit board. A pressure foot of each compressed air pressure cylinder is extendable when an air controller foot switch is depressed. Positioning of each of the cylinders is afforded along two axes, so that the cylinders may be positioned over components which are to be pressed against the circuit board. Heat sinks may be pressed against components located on the circuit board to bond the heat sinks to the components.

Abstract: The present invention is directed to a sterile pharmaceutical composition comprising a propofol containing oil-in-water emulsion formulation having as an antimicrobial agent, a member selected from the group consisting of benzyl alcohol and ethylene diamine tetra acetic acid; benzethonium chloride; and benzyl alcohol and sodium benzoate.

Abstract: The present invention is directed to a sterile pharmaceutical composition comprising a propofol containing oil-in-water emulsion formulation having as an antimicrobial agent, a member selected from the group consisting of benzyl alcohol and sodium ethylene diamine tetraacetate; benzethonium chloride; and benzyl alcohol and sodium benzoate.

Abstract: A solder interconnection between a module and printed circuit board or card is provided by a plurality of solder connections arranged in a micro grid array joining solder wettable pads on a major surface of the module to a corresponding set of solder wettable pads of the printed circuit board or card. The solder connections are column shaped with the height of each connection being at least about 1.4 times the diameter of the connection.

Abstract: A transfer fluxing apparatus is provided. The apparatus is a flux reservoir for holding flux, a compliant pad attached to an opening in the flux reservoir and a means for controlling deposition of flux onto the compliant pad. The apparatus can be attached to an automated component placement machine. In the preferred embodiment of the invention, the control means is a valve located within the flux reservoir. The valve is opened by applying pressure to a plunger that extends through the compliant pad. When the plunger is pressed, the valve opens, and flux falls onto the compliant pad. Flux then passes through the pad to a component placement site. A method for automated fluxing and to component placement also is provided.