Abstract: A tissue-removing catheter for removing tissue in a body lumen includes an elongate body having an axis. A handle is mounted to a proximal end portion of the elongate body. A tissue-removing element is mounted on a distal end portion of the elongate body. An inner liner is received within the elongate body and defines a guidewire lumen. An advancer is mounted on the handle and is movable relative to the housing. The inner liner is coupled to the advancer at a proximal end portion of the inner liner such that movement of the advancer causes a corresponding movement of the inner liner to exert a push force on the tissue-removing element to advance the tissue-removing element and a pull force on the tissue-removing element to retract the tissue-removing element for moving the tissue-removing element relative to the handle.

Abstract: The present invention relates primarily to a method of fabrication of one or more free-standing micromachined parts. The method includes performing reactive ion etching of photoresist and tungsten-based layers supported on a carrier substrate to thereby define one or more micromachined parts, followed by separating the resulting one or more micromachined parts from the carrier substrate such that the parts are free-standing. The invention also relates to tungsten-based microprobe obtainable by such a method, wherein the microprobe has a substantially square or rectangular cross-section in a direction perpendicular to a longitudinal axis of the microprobe, and to probe cards comprising a plurality of such microprobes.

Abstract: A system and method for non-isothermal temperature cycling (also called Conduction Temperature Cycling) of a semiconductor device. The method includes inserting a semiconductor device into a testing chamber and thermally coupling the semiconductor device to a heating and cooling element via a vacuum holding component. The method further includes heating and cooling a die portion of the semiconductor device with the heating and cooling element and testing the semiconductor device for component failure caused by thermo-mechanical stress induced by the non-isothermal temperature cycling. In one embodiment, the heating and cooling comprises non-isothermal temperature cycling.

Abstract: A system and method for non-isothermal temperature cycling (also called Conduction Temperature Cycling) of a semiconductor device. The method includes inserting a semiconductor device into a testing chamber and thermally coupling the semiconductor device to a heating and cooling element via a vacuum holding component. The method further includes heating and cooling a die portion of the semiconductor device with the heating and cooling element and testing the semiconductor device for component failure caused by thermo-mechanical stress induced by the non-isothermal temperature cycling. In one embodiment, the heating and cooling comprises non-isothermal temperature cycling.

Abstract: With the present invention for conveying information regarding an emergency, an alarm system can be notified of number, condition, location, and/or need of assistance of occupants within a building during an emergency. Building occupants can be informed of safe paths along which to proceed during an emergency. Further, a command workstation, such as a fire command workstation, can be integrated into an alarm system having multiple functions, detection devices, and voice communication capabilities.