Abstract: A digital assistant may execute one or more tasks using robotic processing automation (RPA). The digital assistant (or robot) assigns a workflow to a robot to monitor for one or more triggers. The one or more triggers comprise one or more events causing a robot to perform an automated tasks with or without user involvement. The robot also identifies the one or more triggers during the monitoring of the one or more triggers, and loads a workflow associated with the one or more identified triggers. The robot further includes executing the loaded workflow to perform one or more tasks associated with the one or more triggers.

Abstract: A digital assistant may execute one or more tasks using robotic processing automation (RPA). The digital assistant (or robot) assigns a workflow to a robot to monitor for one or more triggers. The one or more triggers comprise one or more events causing a robot to perform an automated tasks with or without user involvement. The robot also identifies the one or more triggers during the monitoring of the one or more triggers, and loads a workflow associated with the one or more identified triggers. The robot further includes executing the loaded workflow to perform one or more tasks associated with the one or more triggers.

Abstract: The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave/THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.

Abstract: The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave/THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.