Patents by Inventor Thomas Muench

Thomas Muench has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11015317
    Abstract: A boom for an earth-moving machine, in particular an excavator, comprising rear and front boom parts that are cohesively assembled to form a boomerang-like boom structure, wherein the central connection between the boom parts is formed by a simple thick central connecting plate.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: May 25, 2021
    Assignee: Liebherr-France SAS
    Inventors: Guillaume Elbel, Johan Pleimelding, Thomas Münch
  • Patent number: 10378182
    Abstract: The present invention relates to a boom for an earth-moving machine, in particular an excavator, with at least two bearing plates for supporting a cylinder unit, which at least for the most part extend parallel to each other in the longitudinal direction of the boom, wherein the bearing plates have an end-side curvature extending outwardly to the lateral edge of the boom.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: August 13, 2019
    Assignee: Liebherr-France SAS
    Inventors: Guillaume Elbel, Thomas Münch, Pascal Fritsch
  • Publication number: 20190085533
    Abstract: The present invention relates to a boom for an earth-moving machine, in particular an excavator, with at least two bearing plates for supporting a cylinder unit, which at least for the most part extend parallel to each other in the longitudinal direction of the boom, wherein the bearing plates have an end-side curvature extending outwardly to the lateral edge of the boom.
    Type: Application
    Filed: September 13, 2018
    Publication date: March 21, 2019
    Inventors: Guillaume ELBEL, Thomas MÜNCH, Pascal FRITSCH
  • Publication number: 20190085527
    Abstract: The present invention relates to a boom for an earth-moving machine, in particular an excavator, comprising rear and front boom parts that are cohesively assembled to form a boomerang-like boom structure, wherein the central connection between the boom parts is formed by a simple thick central connecting plate.
    Type: Application
    Filed: September 13, 2018
    Publication date: March 21, 2019
    Inventors: Guillaume ELBEL, Johan PLEIMELDING, Thomas MÜNCH
  • Publication number: 20130337114
    Abstract: Provided is a fermentation process wherein green ripe uncured vanilla beans are incubated with [microbes] bacillus subtilis in isolated form to convert glucovanillin to vanillin while consistently forming a fully developed well-balanced vanilla aroma without off-notes.
    Type: Application
    Filed: August 21, 2013
    Publication date: December 19, 2013
    Applicant: Givaudan SA
    Inventors: Eva Christina Maria Binggeli, Thomas Muench
  • Patent number: 8580324
    Abstract: Provided is a fermentation process wherein green ripe uncured vanilla beans are incubated with bacillus subtilis in isolated form to convert glucovanillin to vanillin while consistently forming a fully developed well-balanced vanilla aroma without off-notes.
    Type: Grant
    Filed: December 11, 2009
    Date of Patent: November 12, 2013
    Assignee: Givaudan SA
    Inventors: Eva Christina Maria Binggeli, Thomas Muench
  • Publication number: 20110262593
    Abstract: Provided is a fermentation process wherein green ripe uncured vanilla beans are incubated with [microbes] bacillus subtilis in isolated form to convert glucovanillin to vanillin while consistently forming a fully developed well-balanced vanilla aroma without off-notes.
    Type: Application
    Filed: December 11, 2009
    Publication date: October 27, 2011
    Inventors: Eva Christina Maria Binggeli, Thomas Muench
  • Patent number: 7256504
    Abstract: A circuit support for a semiconductor chip with a substrate made of an insulating material has a chip mounting area and a plurality of bonding pads surrounding the chip mounting area. The chip can be applied in a central area of the chip mounting area. A peripheral area surrounding the central area defines the border of the chip mounting area and it is of a far greater length than a length of the lateral edges of the chip to be mounted.
    Type: Grant
    Filed: April 6, 2005
    Date of Patent: August 14, 2007
    Assignee: Siemens Aktiengesellschaft
    Inventors: Silvia Gohlke, Thomas Münch
  • Patent number: 7153143
    Abstract: A circuit carrier includes a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: December 26, 2006
    Assignee: Infineon Technologies A.G.
    Inventor: Thomas Muench
  • Publication number: 20060084285
    Abstract: A circuit carrier includes a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.
    Type: Application
    Filed: December 2, 2005
    Publication date: April 20, 2006
    Inventor: Thomas Muench
  • Patent number: 6991470
    Abstract: The invention relates to a circuit carrier and a method for producing it, the circuit carrier having a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.
    Type: Grant
    Filed: August 6, 2004
    Date of Patent: January 31, 2006
    Assignee: Infineon Technoloies, AG
    Inventor: Thomas Muench
  • Publication number: 20050064732
    Abstract: The invention relates to a circuit carrier and a method for producing it, the circuit carrier having a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.
    Type: Application
    Filed: August 6, 2004
    Publication date: March 24, 2005
    Inventor: Thomas Muench
  • Patent number: 6836953
    Abstract: In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.
    Type: Grant
    Filed: November 6, 2002
    Date of Patent: January 4, 2005
    Assignee: Infineon Technologies AG
    Inventors: Manfred Fries, Thomas Münch, Reinhard Fischbach
  • Patent number: 6630727
    Abstract: A modularly expandable semiconductor component includes at least one carrier layer, at least one intermediate layer, at least one coverlayer, at least one semiconductor chip, external contacts and a conductor configuration. The intermediate layer is provided with at least one opening, into which the at least one semiconductor chip is inserted. The carrier layer, the intermediate layer and the coverlayer are connected one above another and form a submodule. If a plurality of submodules are installed above one another, a semiconductor component is provided in which the semiconductor chips are located in several mutually overlying planes. The semiconductor chips can be interconnected. A method for producing a semiconductor component is also provided.
    Type: Grant
    Filed: September 5, 2000
    Date of Patent: October 7, 2003
    Assignee: Infineon Technologies AG
    Inventors: Günter Tutsch, Thomas Münch
  • Patent number: 6528723
    Abstract: In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.
    Type: Grant
    Filed: January 16, 2001
    Date of Patent: March 4, 2003
    Assignee: Infineon Technologies AG
    Inventors: Manfred Fries, Thomas Münch, Reinhard Fischbach
  • Patent number: 6497932
    Abstract: The transport device for electronic components is formed with at least one recess to accommodate an electronic component. In order to protect the component, the recess is provided with an anticontamination coating.
    Type: Grant
    Filed: June 19, 2000
    Date of Patent: December 24, 2002
    Assignee: Infineon Technologies AG
    Inventors: Thomas Münch, Stefan Paulus
  • Patent number: 6462407
    Abstract: The invention relates to an electronic device having a multiplicity of contact bumps and an intermediate support. In this case, the intermediate support connects the multiplicity of contact bumps to contact areas of a semiconductor chip via a multiplicity of flat conductors which have contact connecting lugs exposed in a bonding channel window of the intermediate support. The contact areas are configured in the bonding channel window via the bonded contact connecting lugs of the flat conductors. The width of the bonding channel window is increasingly greater with increasing distance from the neutral point of the semiconductor chip.
    Type: Grant
    Filed: March 23, 2001
    Date of Patent: October 8, 2002
    Assignee: Infineon Technologies AG
    Inventors: Uta Gebauer, Thomas Münch, Friedrich Wanninger
  • Patent number: 6312962
    Abstract: A method for COB mounting of electronic chips on a circuit board includes contact connection of connecting wires and substantially whole-area adhesive bonding of a housing. A chip is partially adhesively bonded on a circuit board in such a way that the chip can be contact-connected and can be removed again without damage to the circuit board. Electronic tests or a burn-in process is performed on the chip. The chip, with a given functionality in a manner that is required for application of the circuit board, is fully adhesively bonding.
    Type: Grant
    Filed: May 8, 2000
    Date of Patent: November 6, 2001
    Assignee: Infineon Technologies AG
    Inventors: Thomas Münch, Jens Pohl, Oliver Wutz
  • Patent number: 6283932
    Abstract: An orthopedic device comprises a shaft capable of at least partially encircling at least a lower part of a leg, a foot part, a cup-shaped heel part connecting the foot part to the shaft, a continuous bearing surface arranged between the front end of the foot part and the heel part, the bearing surface constituting a lower closure of the orthopedic device and having a side facing the interior of the orthopedic device, which is flat and symmetrical with respect to a central longitudinal axis, and an arch support affixable to said bearing surface side. A portion of the arch support running along an outside of a foot capable of being supported by the arch support extends substantially horizontally, and a portion of the arch support running along an inside of the foot has a shape of a rising arc, a flank of the arc near the heel rising substantially perpendicularly from the bearing surface to an apex and extending from the apex to the foot part.
    Type: Grant
    Filed: May 7, 1999
    Date of Patent: September 4, 2001
    Inventors: Thomas Münch, Meinald Settner
  • Patent number: D474473
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: May 13, 2003
    Assignee: Infineon Technologies AG
    Inventors: Jürgen Fischer, Harald Gundlach, Thomas Muench