Abstract: Filtered feedthrough assembly (100, 200) is formed by mounting a filter support assembly (130, 130', 230) having a capacitor (110,210) mounted thereto, to a conductive feedthrough (10, 10'). The conductive feedthrough includes a metallic ferrule (14, 14') having a centrally disposed through opening (28) extending between opposing ends thereof. At least one elongate lead wire (12) extends through the ferrule through opening. A hermetic seal insulator (20, 20') is disposed within the central opening of the ferrule and is sealed thereto. The filter support assembly (130, 130', 230) includes an insulative substrate (132, 132', 132") having a first metallization pattern (133, 314) formed on an upper surface (138, 138") thereof. A second metallization pattern (135, 316) is formed on the lower surface (124, 124') of substrate (132, 132', 132").

Abstract: A filtered feedthrough assembly (100, 100', 100", 200, 200", 300) for use in implantable medical devices is provided. The filtered feedthrough assembly provides at least one chip capacitor (110, 210) or an LC circuit coupled between a lead wire (12) and an end surface (18) of a metallic ferrule (14). The chip capacitor is secured in position by means of a [non-conductive film (122) and] conductive material (120) applied to opposing ends of the chip capacitor. The end portion of the feedthrough and chip capacitor may be encapsulated by an encapsulant (102) to provide a moisture resistant coating therefor.