Abstract: Apparatuses, methods, and systems for generating a sequential flow of electronic actions for a user are disclosed. One method includes sensing a flow trigger action, scraping characteristics of an electronic presence of the user, characterizing user identifying information using an LLM (large language model) and the characteristics, determining a selection of actions and conditional splits (branches) to form a sequential flow of electronic messages for sub-users of the user, generating one or more electronic messages based on the identifying information and the determined sequential flow of electronic messages, displaying the one or more electronic messages to the user, sensing actions of the user based on the displaying of the one or more electronic messages, finalizing the electronic messages based on the sensed actions of the user, and electronically sending the one or more finalized electronic messages to sub-users of the user.

Abstract: A magnetron sputtering apparatus includes a first independent sputtering target power supply, a second independent sputtering target power supply, a process gas port, a reactive gas port, a vacuum chamber configured to house the first independent sputtering target power supply, the second independent sputtering target power supply, the process gas port, the reactive gas port, and a platform for placing a part for deposition of a coating by the magnetron sputtering apparatus, and processing circuitry. The processing circuitry is configured to alternately sputter a first target and a second target by alternately switching between the first independent sputtering target power supply and the second independent sputtering target power supply, respectively, and control one or more process parameters to yield a predetermined color of the coating deposited onto the part.

Abstract: A method of treating a part, includes placing a bulk molded compound (BMC) part into a vacuum chamber of a magnetron sputtering apparatus and igniting a plasma in the vacuum chamber. A filler layer is deposited onto the surface of the BMC part, and a metal layer is sputter deposited onto the filler layer to create a reflective surface of the BMC part.

Abstract: A method of treating a part, includes placing a bulk molded compound (BMC) part into a vacuum chamber of a magnetron sputtering apparatus and igniting a plasma in the vacuum chamber. A filler layer is deposited onto the surface of the BMC part, and a metal layer is sputter deposited onto the filler layer to create a reflective surface of the BMC part.

Abstract: A coated substrate includes a substrate having a glow-discharged surface; and a coating having a submicrometric layer thickness sputter deposited onto the substrate. The coating having a submicrometric layer thickness has a predetermined absorbance. The predetermined absorbance regulates an amount of light transmitted from a light source through the substrate from a first side to a second side of the substrate. The substrate is opaque on the second side of the substrate when the light source is deactivated on the first side of the substrate. The predetermined absorbance varies as a function of one or more controlled process parameters.

Abstract: A coated substrate includes a substrate having a glow-discharged surface; and a coating having a submicrometric layer thickness sputter deposited onto the substrate. The coating having a submicrometric layer thickness has a predetermined absorbance. The predetermined absorbance regulates an amount of light transmitted from a light source through the substrate from a first side to a second side of the substrate. The substrate is opaque on the second side of the substrate when the light source is deactivated on the first side of the substrate. The predetermined absorbance varies as a function of one or more controlled process parameters.

Abstract: A magnetron sputtering apparatus includes a first independent sputtering target power supply, a second independent sputtering target power supply, a process gas port, a reactive gas port, a vacuum chamber configured to house the first independent sputtering target power supply, the second independent sputtering target power supply, the process gas port, the reactive gas port, and a platform for placing a part for deposition of a coating by the magnetron sputtering apparatus, and processing circuitry. The processing circuitry is configured to alternately sputter a first target and a second target by alternately switching between the first independent sputtering target power supply and the second independent sputtering target power supply, respectively, and control one or more process parameters to yield a predetermined color of the coating deposited onto the part.

Abstract: A perpendicular recording medium with enhanced magnetic stability. In accordance with some embodiments, a multi-layer recording structure is formed on a base substrate and adapted to magnetically store a magnetic bit sequence in domains substantially perpendicular to said layers. A thin magnetic stabilization layer is formed on the multi-layer recording substrate to magnetically stabilize an upper portion of the recording structure.

Abstract: A substrate holder for a substrate including a frame body having an opening for the placement of the substrate. The frame body also includes a hollow portion therein. The substrate holder may be used in a sputtering apparatus for sputtering material onto the substrate. The substrate holder is particularly advantageous in the manufacturing of magnetic recording medium.

Abstract: A process/method for cleaning wafers that eliminates and/or reduces pitting caused by standard clean 1 by performing a pre-etch and then passivating the wafer surface prior to the application of the standard clean 1. The process/method may be especially useful for advanced front end of line post-CPM cleaning. In one embodiment, the invention is a method of processing a substrate comprising: a) providing at least one substrate; b) etching a surface of the substrate by applying an etching solution; c) passivating the etched surface of the substrate by applying ozone; and d) cleaning the passivated surface of the substrate by applying an aqueous solution comprising ammonium hydroxide and hydrogen peroxide.

Abstract: A low-coupling perpendicular magnetic recording media comprising a magnetic storage layer and at least one low saturation magnetization layer. The magnetic storage layer has a saturation magnetization between about 400-900 emu/cm3 and the at least one low saturation magnetization layer has a saturation magnetization below that of the magnetic storage layer.

Abstract: A low-coupling perpendicular magnetic recording media comprising a magnetic storage layer and at least one low saturation magnetization layer. The magnetic storage layer has a saturation magnetization between about 400-900 emu/cm3 and the at least one low saturation magnetization layer has a saturation magnetization below that of the magnetic storage layer.

Abstract: A low-coupling perpendicular magnetic recording media comprising a magnetic storage layer and at least one low saturation magnetization layer. The magnetic storage layer has a saturation magnetization between about 400-900 emu/cm3 and the at least one low saturation magnetization layer has a saturation magnetization below that of the magnetic storage layer.

Abstract: A low-coupling perpendicular magnetic recording media comprising a magnetic storage layer and at least one low saturation magnetization layer. The magnetic storage layer has a saturation magnetization between about 400-900 emu/cm3 and the at least one low saturation magnetization layer has a saturation magnetization below that of the magnetic storage layer.

Abstract: A process/method for cleaning wafers that eliminates and/or reduces pitting caused by standard clean 1 by performing a pre-etch and then passivating the wafer surface prior to the application of the standard clean 1. The process/method may be especially useful for advanced front end of line post-CPM cleaning. In one embodiment, the invention is a method of processing a substrate comprising: a) providing at least one substrate; b) etching a surface of the substrate by applying an etching solution; c) passivating the etched surface of the substrate by applying ozone; and d) cleaning the passivated surface of the substrate by applying an aqueous solution comprising ammonium hydroxide and hydrogen peroxide.

Abstract: A low-coupling perpendicular magnetic recording media comprising a magnetic storage layer and at least one low saturation magnetization layer. The magnetic storage layer has a saturation magnetization between about 400-900 emu/cm3 and the at least one low saturation magnetization layer has a saturation magnetization below that of the magnetic storage layer.

Abstract: A low-coupling perpendicular magnetic recording media comprising a magnetic storage layer and at least one low saturation magnetization layer. The magnetic storage layer has a saturation magnetization between about 400-900 emu/cm3 and the at least one low saturation magnetization layer has a saturation magnetization below that of the magnetic storage layer.

Abstract: A low-coupling perpendicular magnetic recording media comprising a magnetic storage layer and at least one low saturation magnetization layer. The magnetic storage layer has a saturation magnetization between about 400-900 emu/cm3 and the at least one low saturation magnetization layer has a saturation magnetization below that of the magnetic storage layer.

Abstract: A method of forming a granular magnetic recording medium comprises etching a cap layer disposed on a granular magnetic recording layer. The etching process is carried out at a varying ion energy, including a first ion energy and a lower subsequent second energy. A device including the etched cap layer is also disclosed.

Abstract: A substrate holder for a substrate including a frame body having an opening for the placement of the substrate. The frame body also includes a hollow portion therein. The substrate holder may be used in a sputtering apparatus for sputtering material onto the substrate. The substrate holder is particularly advantageous in the manufacturing of magnetic recording medium.