Abstract: An integrated circuit packaging apparatus includes a first conductive layer disposed between an integrated circuit die and a conductive die paddle. Bond wires connect the first conductive layer to the lead frame package and to the integrated circuit die. A first dielectric layer is disposed between the first conductive layer and the conductive die paddle such that the first conductive layer, the first dielectric layer, and the conductive die paddle provide bypass capacitance. A method for providing bypass capacitance and power routing for an integrated circuit packaging apparatus includes; depositing a first dielectric layer on a conductive die paddle, depositing a first conductive layer on the first dielectric layer, and connecting the first conductive layer to the lead frame package and to the integrated circuit die. The first conductive layer, the first dielectric layer, and the conductive die paddle cooperate to provide bypass capacitance.

Abstract: An integrated circuit packaging apparatus includes a first conductive layer disposed between an integrated circuit die and a conductive die paddle. Bond wires connect the first conductive layer to the lead frame package and to the integrated circuit die. A first dielectric layer is disposed between the first conductive layer and the conductive die paddle such that the first conductive layer, the first dielectric layer, and the conductive die paddle provide bypass capacitance. A method for providing bypass capacitance and power routing for an integrated circuit packaging apparatus includes; depositing a first dielectric layer on a conductive die paddle, depositing a first conductive layer on the first dielectric layer, and connecting the first conductive layer to the lead frame package and to the integrated circuit die. The first conductive layer, the first dielectric layer, and the conductive die paddle cooperate to provide bypass capacitance.

Abstract: Embodiments of the present invention provide an integrated circuit. In one embodiment, the integrated circuit comprises logic blocks and a measurement circuit. The measurement circuit is configured to measure internal operating parameters of the integrated circuit to obtain operating parameter data and provide the operating parameter data for evaluation and configuration of the integrated circuit and the logic blocks.

Abstract: Embodiments of the present invention provide an integrated circuit. In one embodiment, the integrated circuit comprises logic blocks, a measurement circuit and a control circuit. The measurement circuit is configured to measure operating parameters of the integrated circuit and the logic blocks and provide operating parameter data. The control circuit is configured to receive the operating parameter data, evaluate the operating parameter data to obtain configuration data and configure the integrated circuit with the configuration data.

Abstract: Embodiments of the present invention provide an integrated circuit. In one embodiment, the integrated circuit comprises logic blocks, a measurement circuit and a control circuit. The measurement circuit is configured to measure operating parameters of the integrated circuit and the logic blocks and provide operating parameter data. The control circuit is configured to receive the operating parameter data, evaluate the operating parameter data to obtain configuration data and configure the integrated circuit with the configuration data.

Abstract: Embodiments of the present invention provide an integrated circuit. In one embodiment, the integrated circuit comprises logic blocks and a measurement circuit. The measurement circuit is configured to measure internal operating parameters of the integrated circuit to obtain operating parameter data and provide the operating parameter data for evaluation and configuration of the integrated circuit and the logic blocks.