Patents by Inventor Thomas Oppert

Thomas Oppert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8923005
    Abstract: An electrical component and a method for the manufacture thereof, comprising a connection arrangement between an active surface of an electrical component and a carrier, wherein electrical connecting elements are disposed in a connection zone on the active surface and/or on the carrier, and at least one spacer element is provided, which is disposed on the active surface and/or on the carrier. The at least one spacer element has a smaller height than the connecting elements before the connecting elements are reflowed to produce the electrically conductive connection, and is preferably disposed in an edge region of the connection zone.
    Type: Grant
    Filed: February 20, 2012
    Date of Patent: December 30, 2014
    Assignee: Micro Systems Engineering GmbH
    Inventors: Rainer Dohle, Florian Schuessler, Rolf Diehm, Oliver Kessling, Thomas Oppert
  • Publication number: 20120212918
    Abstract: An electrical component and a method for the manufacture thereof, comprising a connection arrangement between an active surface of an electrical component and a carrier, wherein electrical connecting elements are disposed in a connection zone on the active surface and/or on the carrier, and at least one spacer element is provided, which is disposed on the active surface and/or on the carrier. The at least one spacer element has a smaller height than the connecting elements before the connecting elements are reflowed to produce the electrically conductive connection, and is preferably disposed in an edge region of the connection zone.
    Type: Application
    Filed: February 20, 2012
    Publication date: August 23, 2012
    Applicant: MICRO SYSTEMS ENGINEERING GMBH
    Inventors: Rainer Dohle, Florian Schuessler, Rolf Diehm, Oliver Kessling, Thomas Oppert
  • Publication number: 20020040923
    Abstract: A contact structure (10) and a process for producing a contact structure are provided for connecting two substrates (11, 12). The process includes applying solder material (23) to terminal areas (16) of a first substrate (11) to form spacing metallizations (19), and bonding of the first substrate (11) with a second substrate (12). The bonding between the terminal areas (16) of the first substrate (11) and a contact surface area of the second substrate (12) is performed by means of an electrically conductive adhesive compound (20).
    Type: Application
    Filed: December 13, 2001
    Publication date: April 11, 2002
    Applicant: Pac Tech-Packaging Technologies GmbH
    Inventors: Jurgen Schredl, Thomas Oppert