Abstract: A system and method for providing an active array of temperature sensing and cooling elements, including an active heatsink which further includes an active temperature sensing layer, a thermoelectric cooling layer, and a heatsink, which further includes a plurality of cooling channels. The temperature sensing element within the active temperature sensing layer includes a plurality of switching transistors, a linear transistor, a current sense resistor, a thermistor, a voltage sensing bus, a voltage setting bus, a current measurement bus, a measurement switching bus, a sense control bus, a storage capacitor, and a supply voltage, all under the control of a process control computer. The method of using an active array of temperature sensing and cooling elements includes the steps of aligning the shadow mask, depositing the material, detecting a thermal gradient, and controlling the thermoelectric cooling.

Abstract: Evaporated receptacles for inkjet deposited polymeric light-emitting diode (PLED)/organic light-emitting diode (OLED) and a method of making the same. The evaporated receptacles are formed via a shadow mask vacuum deposition process. The method of forming a light-emitting display includes forming an electrode on a substrate, forming a receptacle structure over the electrode via a shadow mask vacuum deposition process, and delivering a quantity of polymeric solution, which contains a light-emitting material, into the receptacle via a standard inkjet deposition process.

Abstract: A shadow mask deposition system includes a plurality of identical shadow masks arranged in a number of stacks to form a like number of compound shadow masks, each of which is disposed in a deposition vacuum vessel along with a material deposition source. Materials from the material deposition sources are deposited on the substrate via openings in corresponding compound shadow masks, each opening being formed by the whole or partial alignment of apertures in the shadow masks forming the compound shadow mask, to form an array of electronic elements on the substrate.

Abstract: An electronic circuit with repetitive patterns formed by shadow mask vapor deposition includes a repetitive pattern of electronic circuit elements formed on a substrate. Each electronic circuit element includes the following elements in the desired order of deposition: a first semiconductor segment, a second semiconductor segment, a first metal segment, a second metal segment, a third metal segment, a fourth metal segment, a fifth metal segment, a sixth metal segment, a first insulator segment, a second insulator segment, a third insulator segment, a seventh metal segment, an eighth metal segment, a ninth metal segment and a tenth metal segment. All of the above segments may be deposited via a shadow mask deposition process. The electronic circuit element may be an element of an array of like electronic circuit elements.

Abstract: An LCD pixel includes a first conductive segment connected to a first bus, a first insulator segment on the first conductive segment, a second conductive segment on the first insulator segment, a liquid crystal material on the second conductive segment, a third conductive segment on the liquid crystal material, and a thin film transistor having a control terminal, a first power terminal and second power terminal connected to a second bus, a third bus and the second conductive segment, respectively. In response to application of a suitable signal on the second bus when reference voltages are present on the first bus and on the third conductive segment, and a voltage is applied to the third bus, the thin film transistor is operative for charging a capacitor formed by the first conductive segment, the first insulator segment and the second conductive segment and for activating the liquid crystal material.

Abstract: Electronic devices are formed on a substrate that is advanced stepwise through a plurality of deposition vessels. Each deposition vessel includes a source of deposition material and has at least two shadow masks associated therewith. Each of the two masks is alternately positioned within the corresponding deposition vessel for patterning the deposition material onto the substrate through apertures in the mask positioned therein, and positioned in an adjacent cleaning vessel for mask cleaning. The patterning onto the substrate and the cleaning of at least one of the masks are performed concurrently.

Abstract: A multi-layer electronic device can be formed to include an insulative substrate (212), a first vapor deposited conductor layer (312) on the insulative substrate (212), a first vapor deposited insulator layer (314) on the first conductor layer (312), the first insulator layer (314) having at least one via hole (316) therein, and a vapor deposited conductive filler (320) in the via hole (316) of the first insulator layer (314). Desirably, the conductive filler (320) is deposited in the via hole (316) of the first insulator layer (314) such that the surface of the conductive filler (320) opposite the first conductor layer (312) is substantially planar with the surface of the first insulator layer (314) opposite the first conductor layer (312).

Abstract: A shadow mask deposition system includes a plurality of identical shadow masks arranged in a number of stacks to form a like number of compound shadow masks, each of which is disposed in a deposition vacuum vessel along with a material deposition source. Materials from the material deposition sources are deposited on the substrate via openings in corresponding compound shadow masks, each opening being formed by the whole or partial alignment of apertures in the shadow masks forming the compound shadow mask, to form an array of electronic elements on the substrate.

Abstract: In a shadow mask vapor deposition system, a first conductor is vapor deposited on a substrate and an insulator is vapor deposited on the first conductor. A second conductor is then vapor deposited on at least the insulator. The insulator layer is plasma etched either before or after the vapor deposition of the second conductor to define in the insulator layer a via hole through which at least a portion of the first conductor is exposed. An electrical connection is established between the first and second conductors by way of the via hole.

Abstract: A system and method for active array temperature sensing and cooling. The system includes an active temperature sensing layer, a thermoelectric cooling layer and a heatsink layer. The temperature sensing layer is formed of temperature sensing elements that sense the temperature gradient across an unevenly heated region of the active array substrate. The thermoelectric cooling layer controls the temperature gradient sensed by the temperature sensing layer. The heatsink layer includes a plurality of cooling channels for absorbing thermal energy from the unevenly heated region. The system is under the control of a process control computer.

Abstract: Via holes are formed in a continuous inline shadow mask production system by depositing a first conductor layer and subsequently depositing a first insulator layer over a portion of the first conductor layer. The first insulator layer is deposited in a manner to define at least one notch along its edge. The second insulator layer is then deposited on another portion of the first conductor layer in a manner whereupon the second insulator layer slightly overlaps each notch of the first insulator layer, thereby forming the one or more via holes. A conductive filler can optionally be deposited in each via hole. Lastly, a second conductive layer can be deposited over the first insulator layer, the second insulator layer and, if provided, the conductive filler.

Abstract: An electronic device is formed from electronic elements deposited on a substrate. The electronic elements are deposited on the substrate by advancing the substrate through a plurality of deposition vacuum vessels, with each deposition vacuum vessel having at least one material deposition source and a shadowmask positioned therein. The material from at least one material deposition source positioned in each deposition vacuum vessel is deposited on the substrate through the shadowmask positioned in the deposition vacuum vessel to form on the substrate a circuit comprised of an array of electronic elements. The circuit is formed solely by the successive deposition of materials on the substrate.

Abstract: An electronic device is formed from electronic elements deposited on a substrate. The electronic elements are deposited on the substrate by advancing the substrate through a plurality of deposition vacuum vessels, with each deposition vacuum vessel having at least one material deposition source and a shadowmask positioned therein. The material from at least one material deposition source positioned in each deposition vacuum vessel is deposited on the substrate through the shadowmask positioned in the deposition vacuum vessel to form on the substrate a circuit comprised of an array of electronic elements. The circuit is formed solely by the successive deposition of materials on the substrate.

Abstract: A method of producing a color filter to be used in conjunction with a display element such as an active or passive matrix liquid crystal panel. The color filter is formed by a stack of exposed and developed film layers, and each layer corresponds to a color of the resulting filter. The stack of exposed film layers is deposited on a transparent sheet.

Abstract: A method of producing a color filter to be used in conjunction with a display element such as an active or passive matrix liquid crystal panel. The color filter is formed by a stack of exposed and developed film layers, and each layer corresponds to a color of the resulting filter. The stack of exposed film layers is deposited on a transparent sheet.

Abstract: An improved method of fabricating integrated circuits, particularly active matrix arrays. The present method comprises applying an etch-resist pattern to an integrated circuit by printing to form resist patterns. The circuit is then etched, recoated with a different substance, a new ink pattern applied and the pattern repeated to form the successive layers of the integrated circuit.

Abstract: An improved method of fabricating integrated circuits, particularly active matrix arrays. The present method comprises applying an etch-resist pattern to an integrated circuit by printing to form resist patterns. The circuit is then etched, recoated with a different substance, a new ink pattern applied and the pattern repeated to form the successive layers of the integrated circuit.

Abstract: A modular flat-screen television display having a large area image can be made using an array of modules of easily manufacturable size and preferably removable. The image on each module extends to the edge of the module so that when placed in the array there is no substantial interruption in the television image since the distance between modules is the same as the distance between picture elements within the modules. Control and drive circuitry enable each module to be driven at the same time, thereby decreasing the time it takes to refresh the entire display. The modules contain picture elements which may be emissive, reflective or transmissive.

Abstract: A modular flat-screen television display having a large area image can be made using an array of modules of easily manufacturable size and preferably removable. The image on each module extends to the edge of the module so that when placed in the array there is no substantial interruption in the television image since the distance between modules is the same as the distance between picture elements within the modules. Control and drive circuitry enable each module to be driven at the same time, thereby decreasing the time it takes to refresh the entire display. The modules contain picture elements which may be emissive, reflective or transmissive.

Abstract: A modular flat-screen television display having a large area image can be made using an array of modules of easily manufacturable size and preferably removable. The image on each module extends to the edge of the module so that when placed in the array there is no substantial interruption in the television image since the distance between modules is the same as the distance between picture elements within the modules. Control and drive circuitry enable each module to be driven at the same time, thereby decreasing the time it takes to refresh the entire display. The modules contain picture elements which may be emissive, reflective or transmissive.