Abstract: A process and circuit board assembly by which a single soldering operation produces a multicomponent stack capable of dissipating heat from a power IC chip (12) mounted to a substrate (10). The circuit board assembly generally includes a number of conductors (16) on the substrate (10), with the conductors (16) being spaced apart and substantially parallel to each other. A heat spreader (14) is soldered to at least some of the conductors (16), and the chip (12) is soldered to the heat spreader (14). With this structure, heat is conducted from the chip (12) through the heat spreader (14) and conductors (16) to the substrate (10). To maintain proper orientation of the components (12, 14, 16) relative to each other during a single soldering operation, the components (12, 14, 16) are equipped with complementary features.

Abstract: A bond pad is provided for improving the reliability of the bond joints between a surface-mounted integrated circuit package and a conductor on a circuit board substrate. In particular, the reliability of the bond joints is promoted by preventing the bond pad from being placed upside down on the conductor, wherein a material mismatch occurs between the bond pad and the aluminum alloy wire used to electrically connect the package leads to the bond pad, and between the bond pad and the conductor patterned on the substrate. To avoid such a mismatch, the bond pad is configured such that it cannot be picked up with conventional vacuum-operated pick and place devices when delivered upside down to the loading station. As a result, only properly oriented bond pads will be placed on the circuit board, such that the bond pad properly presents the appropriate bond surfaces to the conductor and wire during assembly.

Abstract: Locking hub tool apparatus is disclosed which includes a cross member and a pair of outwardly extending rods secured to the cross member for engaging opposite sides of a web of a locking hub to turn the locking hub, and the ends of the cross member are configured to provide working surfaces for the tool.

Abstract: Adjustable drawing sweep apparatus is disclosed which includes a flexible sweep pivotally secured to one end of a base member and extending to an adjustable lever secured to the opposite end of the base member. The lever includes a plurality of notches into which the flexible sweep may be disposed and it also includes adjustment means for pivoting the lever with respect to the base and to the flexible sweep member.