Abstract: The disclosed shuttle apparatus provides for the transfer back and forth from compartment to compartment, electronic devices being environmentally stress tested in a multi-compartment environmental chamber of at least three compartments where the temperature in each adjacent compartment is of the opposite temperature extreme. The compact design of the environmental chamber makes it conductive to the small and medium size manufacturer for use in production assembly lines to eliminate latent defects in components and manufacturing processes contained in assemblies. The transfer is completed by activating a pneumatic cylinder to move the shuttle table. As each transfer is completed, doors affixed to the shuttle table form a seal with the door frame of each compartment thereby insulating each compartment's temperature from that of the other. The door and table assembly allows for the user to quickly load and unload electronic devices, subassemblies, and assemblies and/or their carriers.