Abstract: A leaded component (10) is provided with first and second leads (14 & 16). The leads are formed with stopping deviations (26 & 28) which prevent the leads from being inserted into a circuit board (38) beyond the stopping deviations. The leads may also be provided with retaining deviations (34 & 36) which function to retain the component on the circuit board. Further, the stopping deviations may be formed so as to indicate the polarity of a component, and finally, the stopping deviations may be provided with mounting portions (50 & 52) so that the leaded component may be surface mounted on a circuit board (54).

Abstract: A station (10) in a manufacturing line (12) for the accurate placement of solder balls (30) on a ball grid array package and for the removal of excess solder balls comprises a substrate (4) having an array of solder pads (7), and an adhesion layer (8) on the solder pads.

Abstract: A robotic placement device (FIG. 1) comprises a programmable end-effector (200) for picking and placing component parts. The programmable end-effector (200) comprises a cylinder (201) having a piston (202) including a first (203) and second (208) shafts coupled together. The first shaft (203) of the piston is larger than the second shaft (208). A controller (102) controls a pressure applied to the cylinder (201) and the piston (202) including the first (203) and second (208) shafts of the programmable end-effector (200) establishes a predetermined placement force at the programmable end-effector (200) while placing component parts. A control circuit 118 senses the pressure and in response thereto generates a signal. A processor 108 coupled to the controller (102) processes the signal and in response thereto varying the pressure for maintaining a substantially constant placement force at the programmable end-effector (200) while the programmable end-effector (200) moves vertically.