Abstract: The invention relates to a funnel plate and method of use thereof which facilitates transfer of components from a first tray to a second tray assisting in the packaging, shipping, or assembly of electronic components. The invention provides a plate which includes at least one aperture having internal surfaces which are beveled. The sloped internal surfaces of the apertures precisely aligns electrical component transfer reducing the need for complex post-alignment testing. The funnel plates and processes of the present invention are easily integrated into modern in-line transfer machines.