Abstract: A processing circuit includes a plurality of circuit blocks connected in series to a high-voltage supply and a voltage equalizer. The plurality of circuit blocks includes a corresponding plurality of voltage supply terminals and a corresponding plurality of ground terminals. Each circuit block of the plurality of circuit blocks includes a voltage supply terminal of the plurality of voltage supply terminals and a ground terminal of the plurality of ground terminals. At least two of the plurality of circuit blocks are serially coupled to each other. The voltage equalizer includes a plurality of equalizer terminals. An equalizer terminal of the plurality of equalizer terminals is coupled to a corresponding voltage supply terminal of the plurality of voltage supply terminals. The voltage supply terminal of at least one circuit block of the plurality of circuit blocks is coupled to a high-voltage source.

Abstract: Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.

Abstract: A package substrate and a package assembly including a package substrate including a substrate body including a plurality of first contact points on a surface thereof configured for electrical connection to a first die and a plurality of second contact points on the surface configured for electrical connection to a second die; and a bridge coupled to the substrate body, the bridge including active device circuitry that is coupled to ones of the plurality of first contact points and ones of the plurality of second contact points. A method of forming a package assembly including coupling a first die to a package substrate, the package substrate including a bridge substrate including active device circuitry; and coupling a second die to the package substrate, wherein coupling the first die and the second die to the package substrate includes coupling the first die and the second die to the active circuitry.

Abstract: Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.

Abstract: An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.

Abstract: An interface. A first set of single-ended transmitter circuits reside on a first die having a master device. A first set of single-ended receiver circuits reside on a second die. The receiver circuits have no termination and no equalization. The second die has a slave device responsive to the master device of the first die. Conductive lines connect the first set of transmitter circuits and the first set of receiver circuits. The lengths of the conductive lines are matched.

Abstract: An on-package interface. A first set of single-ended transmitter circuits on a first die. The transmitter circuits are impedance matched and have no equalization. A first set of single-ended receiver circuits on a second die. The receiver circuits have no termination and no equalization. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.

Abstract: An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines arc matched.

Abstract: An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.

Abstract: An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.

Abstract: Mechanisms for clock gating. A clock generation circuit provides a clock signal over a clock signal distribution network within an integrated circuit package. Gating elements within the clock signal distribution network disable the clock signal to one or more portions of the clock signal distribution network. A digital locked loop (DLL) maintains settings without tracking when the clock signal is disabled.

Abstract: An apparatus and system for controlling traffic on an on-chip network. Embodiments of the apparatus comprise single-ended transmission circuitry and single-ended receiving circuitry on a first chip for coupling with a second chip, the transmission circuitry having impedance matching and lacking equalization, the receiving circuitry lacking equalization, the transmission circuitry and the receiving circuitry having statically configurable features and organized in clusters, wherein the clusters have the same physical layer circuitry design for different configurations of the configurable features, the configurable features including half-duplex mode and full-duplex mode, wherein the first chip and the second chip are on the same package, and wherein a plurality of conductive lines for coupling the first chip with the second chip are matched.

Abstract: An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.

Abstract: An interface. A first set of single-ended transmitter circuits reside on a first die having a master device. A first set of single-ended receiver circuits reside on a second die. The receiver circuits have no termination and no equalization. The second die has a slave device responsive to the master device of the first die. Conductive lines connect the first set of transmitter circuits and the first set of receiver circuits. The lengths of the conductive lines are matched.

Abstract: Low power, jitter and latency clocking with common reference clock signals for on-package input/output interfaces. A filter phase locked loop circuit in a master device on a first die provides a clock signal having a frequency of 2F. A local phase locked loop circuit in the master device on the first die is coupled with the filter phase locked loop to provide a clock signal to functional components of the master device through a local clock divider circuit to provide a clock signal of F to the functional components. A remote phase locked loop circuit in a slave device on a second die is coupled with the filter phase locked loop to provide a clock signal to one or more functional components of the slave device through a local clock divider circuit to provide a clock signal of F to the functional components.

Abstract: An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines arc matched.

Abstract: Mechanisms for clock gating. A clock generation circuit provides a clock signal over a clock signal distribution network within an integrated circuit package. Gating elements within the clock signal distribution network disable the clock signal to one or more portions of the clock signal distribution network. A digital locked loop (DLL) maintains settings without tracking when the clock signal is disabled.

Abstract: An apparatus and system for controlling traffic on an on-chip network. Embodiments of the apparatus comprise single-ended transmission circuitry and single-ended receiving circuitry on a first chip for coupling with a second chip, the transmission circuitry having impedance matching and lacking equalization, the receiving circuitry lacking equalization, the transmission circuitry and the receiving circuitry having statically configurable features and organized in clusters, wherein the clusters have the same physical layer circuitry design for different configurations of the configurable features, the configurable features including half-duplex mode and full-duplex mode, wherein the first chip and the second chip are on the same package, and wherein a plurality of conductive lines for coupling the first chip with the second chip are matched.

Abstract: An on-package interface. A first set of single-ended transmitter circuits on a first die. The transmitter circuits are impedance matched and have no equalization. A first set of single-ended receiver circuits on a second die. The receiver circuits have no termination and no equalization. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.

Abstract: Low power, jitter and latency clocking with common reference clock signals for on-package input/output interfaces. A filter phase locked loop circuit in a master device on a first die provides a clock signal having a frequency of 2F. A local phase locked loop circuit in the master device on the first die is coupled with the filter phase locked loop to provide a clock signal to functional components of the master device through a local clock divider circuit to provide a clock signal of F to the functional components. A remote phase locked loop circuit in a slave device on a second die is coupled with the filter phase locked loop to provide a clock signal to one or more functional components of the slave device through a local clock divider circuit to provide a clock signal of F to the functional components.