Abstract: Polyurethanes are made by curing a reaction mixture containing a polyether polyol that contains residues of a zinc hexacyanocobaltate catalyst complex. The reaction mixture contains certain chelating agents in small quantities. The amount of cobalt that is extractable from the polyurethane is reduced.

Abstract: Embodiments of the present disclosure are directed towards isocyanate reactive compositions that include a polyol and tris(4-hydroxyphenyl)methane alkoxylate.

Abstract: Hydroxyl-containing copolymers of butylene oxide and ethylene oxide having a hydroxyl equivalent weight of at least 150, an average of 1.8 to 6 hydroxyl groups per molecule of which hydroxyl groups at least 70% are primary hydroxyl groups and an oxyethylene content of no greater than 10% by weight based on the weight of the copolymer, are useful for making polyurethanes. These polyols are characterized by high reactivity and fast curing times. Polyurethanes made using these polyols have excellent mechanical properties and are highly hydrophobic.

Abstract: Polyurethanes are made in a one-shot process from one or more polyols having a hydroxyl equivalent weight of at least 350, wherein at least 50% of the weight of iii) is a hydroxyl-containing polymer of propylene oxide, the hydroxyl-containing polymer of propylene oxide having a hydroxyl equivalent weight of at least 350, an average of 1.8 to 3 hydroxyl groups per molecule of which hydroxyl groups 40 to 70% are primary hydroxyl groups, an oxyethylene content of no greater than 10% by weight based on the weight of the polymer and a polydispersity of 1.175 or less. The polyurethanes exhibit excellent mechanical properties, are highly hygroscopic and cured rapidly.

Abstract: A chemical mechanical polishing pad for polishing a semiconductor substrate is provided containing a polishing layer that comprises a polyurethane reaction product of a reaction mixture comprising (i) one or more diisocyanate, polyisocyanate or polyisocyanate prepolymer, (ii) from 40 to 85 wt. % based on the total weight of (i) and (ii) of one or more blocked diisocyanate, polyisocyanate or polyisocyanate prepolymer which contains a blocking agent and has a deblocking temperature of from 80 to 160° C., and (iii) one or more aromatic diamine curative. The reaction mixture has a gel time at 80° C. and a pressure of 101 kPa of from 2 to 15 minutes; the polyurethane reaction product has a residual blocking agent content of 2 wt. % or less; and the polishing layer exhibits a density of from 0.6 to 1.2 g/cm3.

Abstract: The shelf life of B-side compositions comprising a polyol, a surfactant, a blowing agent, an organometallic or metal salt catalyst wherein the metal of the catalyst comprises Zn or Bi, and from 1 to 10 weight percent water is improved by the addition of a thiol compound.

Abstract: A process for removing contaminants from a fiber reinforcement material, the process comprising: (a) feeding a fiber reinforcement into a heated vessel, (b) passing the fiber reinforcement through the heated vessel, (c) heating a source of fluid medium, (d) feeding the heated fluid medium from (c) into the heated vessel having a passageway in the heated vessel for allowing the heated fluid medium from (c) to enter into the heated vessel, (e) passing the heated fluid medium through the heated vessel; wherein the heated vessel has a passageway for allowing the heated fluid medium from (c) to exit the heated vessel, and (f) contacting the fiber reinforcement passing through the heated vessel with the heated fluid medium passing through the heated vessel such that any contaminants present in or on the fiber reinforcement is sufficiently reduced to provide a purified fiber reinforcement exiting the heated vessel.

Abstract: A chemical mechanical polishing pad for polishing a semiconductor substrate is provided containing a polishing layer that comprises a polyurethane reaction product of a reaction mixture comprising (i) one or more diisocyanate, polyisocyanate or polyisocyanate prepolymer, (ii) from 40 to 85 wt. % based on the total weight of (i) and (ii) of one or more blocked diisocyanate, polyisocyanate or polyisocyanate prepolymer which contains a blocking agent and has a deblocking temperature of from 80 to 160° C., and (iii) one or more aromatic diamine curative. The reaction mixture has a gel time at 80° C. and a pressure of 101 kPa of from 2 to 15 minutes; the polyurethane reaction product has a residual blocking agent content of 2 wt. % or less; and the polishing layer exhibits a density of from 0.6 to 1.2 g/cm3.