Abstract: The present disclosure describes apparatuses and techniques for device-based die authentication. In some aspects, an intensity of a particle beam is varied during semiconductor processing to provide a semiconductor die having devices of varied values. In other aspects, different areas of semiconductor dies are exposed during semiconductor processing to provide semiconductor dies with devices that vary in value from one die to the next. For each semiconductor die, a value generated based on the values of the die's respective devices can be associated with that die thereby enabling subsequent authentication of the semiconductor die.

Abstract: The present disclosure describes apparatuses and techniques for device-based die authentication. In some aspects, an intensity of a particle beam is varied during semiconductor processing to provide a semiconductor die having devices of varied values. In other aspects, different areas of semiconductor dies are exposed during semiconductor processing to provide semiconductor dies with devices that vary in value from one die to the next. For each semiconductor die, a value generated based on the values of the die's respective devices can be associated with that die thereby enabling subsequent authentication of the semiconductor die.

Abstract: Embodiments of the present invention provide a method/apparatus to measure the jitter of a timing signal used in an integrated circuit chip. The method/apparatus is used to send data from a launch element using a synchronous data path of the timing signal, receive the data at a capture element using the synchronous data path, wherein the launch element and the capture element are disposed on the same integrated circuit chip upon which the timing signal is generated and/or used, and gather statistics about whether a timing violation has occurred by comparing the sent data with the received data over the course of multiple launch/capture events as the timing is adjusted. Other embodiments may be described and/or claimed.