Abstract: Systems, devices, and methods for measuring the dynamic properties of metamaterials at the microscale are provided. For example, laser-induced resonant acoustic spectroscopy (LIRAS) can be used as a non-destructive and/or non-contact optical framework within a material of interest to measure photoacoustic excitation of elastic waves. The system can include a pulsed-laser-based mechanical characterization technique that emits lasers at the sample of interest from various directions to demonstrate a high-throughput non-contact framework that employs MHz-wave propagation signatures to create a vibrational response. The vibrational response of the sample of interest can be used to extract dynamic mechanical properties thereof, such as omnidirectional elastic information, damping properties, and defect quantification. In some embodiments, the LIRAS technique can be employed in a characterization module within an additive manufacturing system to measure parameters of printed parts.

Abstract: In some embodiments, a method to excite a shock wave in a target assembly includes: splitting a pulsed laser beam into a plurality of pulsed laser beams; spatially shaping the plurality of pulsed laser beams into a plurality of concentric pulsed laser rings of different diameters; and adjusting temporal and/or spatial intervals between the concentric pulsed laser rings to substantially match propagation times of a ring-shaped laser-driven shock wave from one ring to the next in a shock propagation layer of the target assembly.

Abstract: In some embodiments, a method to excite a shock wave in a target assembly includes: splitting a pulsed laser beam into a plurality of pulsed laser beams; spatially shaping the plurality of pulsed laser beams into a plurality of concentric pulsed laser rings of different diameters; and adjusting temporal and/or spatial intervals between the concentric pulsed laser rings to substantially match propagation times of a ring-shaped laser-driven shock wave from one ring to the next in a shock propagation layer of the target assembly.