Abstract: Methods of fabricating fiber structures with embedded sensors are provided. The method includes obtaining a scaffold fiber and forming, by 1½-D printing using laser induced chemical vapor deposition, circuitry on the scaffold fiber to provide a fiber structure with embedded sensor. The forming includes printing a solid state oscillator about the scaffold fiber, and printing a sensing device about the scaffold fiber electrically coupled to the solid state oscillator to effect, at least in part, oscillations of the solid state oscillator. The forming further includes printing an antenna about the scaffold fiber electrically connected to the solid state oscillator to facilitate in operation wireless transmitting of a signal from the fiber structure with embedded sensor.

Abstract: Antenna switching circuitry includes an antenna node, a number of signal path nodes, and a number of switching elements. Each one of the switching elements is coupled between a different one of the signal path nodes and the antenna node. At least two of the signal path nodes are coupled together in order to form a low distortion node, such that the switching elements between the low distortion node and the antenna node are used to pass a low-distortion radio frequency (RF) signal. By coupling two of the signal path nodes together, a low distortion signal path is created to the antenna. Creating a low distortion signal path using multiple switching elements allows for the size of the switching elements to remain small, which reduces the parasitic capacitance of each one of the switches and therefore the insertion loss of the antenna switching circuitry.

Abstract: Antenna switching circuitry includes an antenna node, a number of signal path nodes, and a number of switching elements. Each one of the switching elements is coupled between a different one of the signal path nodes and the antenna node. At least two of the signal path nodes are coupled together in order to form a low distortion node, such that the switching elements between the low distortion node and the antenna node are used to pass a low-distortion radio frequency (RF) signal. By coupling two of the signal path nodes together, a low distortion signal path is created to the antenna. Creating a low distortion signal path using multiple switching elements allows for the size of the switching elements to remain small, which reduces the parasitic capacitance of each one of the switches and therefore the insertion loss of the antenna switching circuitry.

Abstract: A method for making a bond-wire interconnect to pass signals between different substrates is described. According to this process, a first compensated bond wire interconnect is made to connect two substrates of a first type at an operating frequency, the first interconnect comprising a bond-wire of a fixed length and a first pair of compensation structures formed from a lowpass filter prototype. A second compensated bond wire interconnect is made to connect two substrates of a second type at the operating frequency, the second interconnect having a bond-wire of the fixed length and a second pair of compensation structures formed from the lowpass filter prototype. A bond-wire of the fixed length, one compensation structure from the first pair, and one compensation structure from the second pair, are combined to make a third compensated bond wire interconnect to connect a substrate of the first type with a substrate of the second type at the operating frequency.

Abstract: A method for making a bond-wire interconnect to pass signals between different substrates is described. According to this process, a first compensated bond wire interconnect is made to connect two substrates of a first type at an operating frequency, the first interconnect comprising a bond-wire of a fixed length and a first pair of compensation structures formed from a lowpass filter prototype. A second compensated bond wire interconnect is made to connect two substrates of a second type at the operating frequency, the second interconnect having a bond-wire of the fixed length and a second pair of compensation structures formed from the lowpass filter prototype. A bond-wire of the fixed length, one compensation structure from the first pair, and one compensation structure from the second pair, are combined to make a third compensated bond wire interconnect to connect a substrate of the first type with a substrate of the second type at the operating frequency.