Abstract: A pipe carrier in an embodiment includes a pipe-carrying region in which forward and rear pipe lifting assemblies are arranged to lift and carry a pipe section. For example, the pipe-carrying region lies rearwards of the front traveling support of the pipe carrier, and forwards of the rear traveling support of the pipe carrier. The pipe carrier includes a modular extension assembly carrying an energy source for powering the pipe carrier, wherein the energy source is at least partially carried within the pipe-carrying region.

Abstract: A pipe carrier in an embodiment includes a pipe-carrying region in which forward and rear pipe lifting assemblies are arranged to lift and carry a pipe section. For example, the pipe-carrying region lies rearwards of the front traveling support of the pipe carrier, and forwards of the rear traveling support of the pipe carrier. The pipe carrier includes a modular extension assembly carrying an energy source for powering the pipe carrier, wherein the energy source is at least partially carried within the pipe-carrying region.

Abstract: In a system including a plurality of diverse semiconductor manufacturing facilities, each of the facilities having a respective manufacturing process requiring semiconductor specific design information in a corresponding diverse format, a method for supplying data to each of the facilities in an appropriate format includes establishing a database for each of the plurality of facilities, the database identifying the appropriate format for each of the facilities. The method also includes receiving semiconductor specific design information and converting the design information in accordance with the appropriate format for one of selected ones of the facilities. The method further includes providing a respective tapeout to said one of the selected ones of the facilities, each tapeout comprising the design information formatted in the appropriate format for the respective facility receiving the tapeout.