Patents by Inventor Thomas Polk Moffat

Thomas Polk Moffat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240229282
    Abstract: Hysteretic current-voltage mediated void-free superconformal and bottom-up filling of recessed features includes providing an electrodeposition composition with a hysteretic cyclic voltammogram; providing the substrate controlling applied electric potential; autonomously reducing the deposition potential of the recess; bifurcating the recess; forming a transition zone and moving the transition zone through the metal deposition; and reducing metal ions to form metal; and forming a resistance enhanced superconformal filling in the recess from the metal, such that forming the resistance enhanced superconformal filling occurs in consequence of autonomously reducing the deposition potential of the recess.
    Type: Application
    Filed: May 12, 2022
    Publication date: July 11, 2024
    Inventors: Trevor Michael Braun, Thomas Polk Moffat, Daniel Josell
  • Patent number: 11733439
    Abstract: A metallic grating is formed to include a substrate; a plurality of high aspect ratio trenches disposed in the substrate such that the high aspect ratio trenches are spaced apart from one another by a field surface of the substrate; a metallic superconformal filling formed and disposed in the high aspect ratio trenches; and a grating including a spatial arrangement of the high aspect ratio trenches that are filled with the metallic superconformal filling such that the metallic superconformal filling is void-free, and the high aspect ratio trenches are bottom-up filled with the metallic superconformal filling, wherein a height of the metallic superconformal filling is less than or equal to the height of the high aspect ratio trenches.
    Type: Grant
    Filed: October 25, 2022
    Date of Patent: August 22, 2023
    Assignee: GOVERNMENT OF THE UNITED STATES OF AMERICA. AS REPRESENTED BY THE SECRETARY OF COMMERCE
    Inventors: Daniel Josell, Thomas Polk Moffat
  • Patent number: 11579344
    Abstract: A metallic grating includes a substrate; a plurality of high aspect ratio trenches disposed in the substrate such that the high aspect ratio trenches are spaced apart from one another by a field surface of the substrate; a metallic superconformal filling formed and disposed in the high aspect ratio trenches; and a grating including a spatial arrangement of the high aspect ratio trenches that are filled with the metallic superconformal filling such that the metallic superconformal filling is void-free, and the high aspect ratio trenches are bottom-up filled with the metallic superconformal filling, wherein a height of the metallic superconformal filling is less than or equal to the height of the high aspect ratio trenches.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: February 14, 2023
    Assignee: GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE
    Inventors: Daniel Josell, Thomas Polk Moffat
  • Publication number: 20230037933
    Abstract: A metallic grating is formed to include a substrate; a plurality of high aspect ratio trenches disposed in the substrate such that the high aspect ratio trenches are spaced apart from one another by a field surface of the substrate; a metallic superconformal filling formed and disposed in the high aspect ratio trenches; and a grating including a spatial arrangement of the high aspect ratio trenches that are filled with the metallic superconformal filling such that the metallic superconformal filling is void-free, and the high aspect ratio trenches are bottom-up filled with the metallic superconformal filling, wherein a height of the metallic superconformal filling is less than or equal to the height of the high aspect ratio trenches.
    Type: Application
    Filed: October 25, 2022
    Publication date: February 9, 2023
    Inventors: Daniel Josell, Thomas Polk Moffat
  • Publication number: 20200301051
    Abstract: A metallic grating includes a substrate; a plurality of high aspect ratio trenches disposed in the substrate such that the high aspect ratio trenches are spaced apart from one another by a field surface of the substrate; a metallic superconformal filling formed and disposed in the high aspect ratio trenches; and a grating including a spatial arrangement of the high aspect ratio trenches that are filled with the metallic superconformal filling such that the metallic superconformal filling is void-free, and the high aspect ratio trenches are bottom-up filled with the metallic superconformal filling, wherein a height of the metallic superconformal filling is less than or equal to the height of the high aspect ratio trenches.
    Type: Application
    Filed: June 10, 2020
    Publication date: September 24, 2020
    Inventors: Daniel Josell, Thomas Polk Moffat