Abstract: The circuit board apparatus (10) includes a first layer (12, 14), a second layer (12, 14) and an inner plate (19) disposed between the first layer (12, 14) and the second layer (12, 14). A fluid distributing conduit (38) is disposed in the inner plate (19). The fluid distributing conduit (38) has a first end (22), a central portion (24) defining a chamber, and a second end (26). A first electronic component (28) is disposed within the chamber (24). A nozzle (60) is disposed in the fluid distributing conduit (38). The nozzle (60) receives a fluid, atomizes the fluid and discharges the atomized fluid (70) into the chamber (24).

Abstract: The apparatus includes a plate (10) having a first layer (12) and a second layer (14) opposed to the first layer (12). The second layer (14) includes a first substrate. A fluid distributing manifold (28) is disposed proximate the first layer (12). A nozzle housing (30) having an aperture (36) is disposed in the first fluid distributing manifold (28).

Abstract: Method and apparatus are disclosed for printed circuit board assembly wherein optimal placement of components are effected. Components, such as microminiature components, are placed, at least on the underside of the circuit board, whereby specially contoured solder pads effect a self-alignment of such components prior to their being affixed in place by a suitable adhesive material.