Patents by Inventor Thomas R. McLean

Thomas R. McLean has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11970485
    Abstract: Disclosed herein are compounds of formula I: or a pharmaceutically acceptable salt thereof, where the variables are as defined herein. These compounds are useful in treating RET associated cancers. Formulations containing the compounds of formula I and methods of making the compounds of formula I are also disclosed.
    Type: Grant
    Filed: October 19, 2022
    Date of Patent: April 30, 2024
    Assignee: ELI LILLY AND COMPANY
    Inventors: Gabrielle R. Kolakowski, Erin D. Anderson, Steven W. Andrews, Christopher Pierre Albert Jean Boldron, Kevin R. Condroski, Thomas C. Irvin, Manoj Kumar, Elizabeth A. McFaddin, Megan L. McKenney, Johnathan Alexander McLean, Tiphaine Mouret, Michael J. Munchhof, Thomas Pierre Dino Pancaldi, Michael Alexander Pilkington-Miksa, Marta Pinto
  • Patent number: 5569957
    Abstract: Lead inductance of a power MOSFET circuit layouts is effectively reduced a `vertically` parallel terminal lead configuration that serves to cancel magnetic flux linkage between adjacent leads, thereby reducing the effective inductance in terminal leads to the gate, source and drain regions of the circuit. Rather than lay out source, drain and gate terminal leads in long, meandering shapes without regard to their direction or mutual coupling effects, as in conventional structures, source and drain leads are arranged as vertically parallel pair of generally flat conductors, that overlie one another on opposite sides of a thin strip of insulating material.
    Type: Grant
    Filed: October 31, 1994
    Date of Patent: October 29, 1996
    Assignee: Harris Corporation
    Inventor: Thomas R. McLean
  • Patent number: 5049973
    Abstract: A packaging assembly for electrical components includes a heat sink having a mounting surface upon which certain ones of the electrical components are mounted. An associated lead frame is rigidly secured to an edge of the heat sink, and one or more extended ends of selected leads thereof are formed into mounting pads positioned over the mounting surface of the heat sink for receiving other ones of the electrical components. Dielectric material is positioned between the mounting pads and the heat sink, for electrically isolating the electrical components mounted upon the mounting pads from one another and from electrical components mounted directly on the heat sink. The electrical components and proximate ends of the leads of the lead frame are electrically interconnected via electrical conductors, and the assembly is encapsulated with a plastic material about the heat sink and proximate ends of the lead frame, whereafter bridge elements between the leads of the lead frame are severed.
    Type: Grant
    Filed: June 26, 1990
    Date of Patent: September 17, 1991
    Assignee: Harris Semiconductor Patents, Inc.
    Inventors: Robert J. Satriano, Thomas R. McLean