Abstract: The present invention provides porous composite materials and methods of making and using the same. In one embodiment, a porous composite material comprises a porous substrate comprising a first polymeric material and at least one particle or fiber of a second polymeric material and a third polymeric material disposed on at least one surface of the porous substrate and having at least one point of attachment the to the at least one particle or fiber of the second polymeric material.

Abstract: A filter has a longitudinal axis with an inner diameter defined by a hollow longitudinally extending center. The filter has fingers extend radially outwardly arcuately from the longitudinal axis. The fingers have base ends near the longitudinal axis and outer edges at extremities spaced from the longitudinal axis. The outer diameter of the filter is defined by the outer edges of the fingers. The filter is formed from a sintered porous molded thermoplastic or another material resulting in a filter more rigid than standard filters. The fingers are spaced apart from one another a predetermined, substantially fixed distance to form slots therebetween sized to capture contaminants therein.

Abstract: The invention provides composite porous materials in which a second material is fused to and/or is in the pores and/or is fused directly to some of the pore walls of a porous first material. The invention also provides methods of filtering a fluid using these composite porous materials and methods of manufacturing the composite porous materials.

Abstract: A substrate for mounting a flip-chip on a metallized circuit on the upper surface of the substrate. The substrate is silicon carbide condensed on a graphite or silicon core. The upper surface of the silicon carbide has a layer of insulating material comprised of silicon oxide, silicon nitride, aluminum nitride, boron nitride, an organic insulator such as polyimide, and diamond. The insulator prevents inadvertent shorting of the integrated circuit. The insulating layer can be deposited on the silicon carbide by such processes as chemical vapor deposition, sputtering, spinning or roller coating.