Abstract: The present invention relates to processing a material. The material lies on a carrier and is cut by irradiation with a laser beam, or an object of the material is catapulted from the carrier to a collection device by means of the laser beam. An image of the material on the carrier is generated. The image is evaluated automatically in order to identify structures in it. A region of the image is automatically selected on the basis of the identified structures. The selected region is then used for automatically cutting the material and/or catapulting the object, or serves as a working region in which the material is cut or from which the object is catapulted. Parallel sections through the material may in particular be employed.

Abstract: The present invention relates to a method for processing a material, as well as to a control system which is suitable for controlling a corresponding device in such a way that it carries out the method essentially automatically. The material lies on a carrier (3) and is cut by irradiation with a laser beam, or an object of the material is catapulted from the carrier (3) to a collection device (2) by means of the laser beam. In this context, an image of the material on the carrier (3) is generated by imaging means (1). The image is evaluated automatically in order to identify structures in it. A region of the image is automatically selected on the basis of the identified structures. The selected region is then used for automatically cutting the material and/or catapulting the object, or serves as a working region in which the material is cut or from which the object is catapulted. Parallel sections through the material may in particular be employed.