Abstract: In a module tape (1) comprising modules (2) and comprising a carrier layer (19) to which a plurality of contact-bound-mode module contact zones (9, 10, 11) are attached at the location of a first layer side (20) and to which a plurality of contactless-mode module contact zones (14, 15) are attached at the location of a second layer side (22), the contactless-mode module contact zones (14, 15) are formed by conductor zones deposited on the carrier layer (19) by means of a printing method.

Abstract: A data carrier has a carrier body with a recess, an insulating layer with an outer surface exposed to an environment of the data carrier and with an inner surface, a chip module that is mounted in the recess, and a transmission coil with coil contacts. The chip module has a chip with chip contacts, a cover of electrically insulating material, and a metal lead frame. The transmission coil is mounted in a zone outside the chip module. The metal lead frame has a first part, a second part and a third part. The first, second a third parts are substantially coplanarly arranged with respect to each other. The first part carries the chip at a side remote from the environment, and the second and third parts form lead frame contacts that are electrically coupled to the coil contacts and the chip contacts. The insulating layer and a cover part inside the data carrier form the cover.

Abstract: A data carrier has a chip with chip contacts, a transmission coil for contactless communication with a write/read station, a metal lead frame with a chip carrying part and contact forming parts, and a chip cover made of electrically insulating material. The transmission coil has coil contacts. The chip cover has a first cover part covering the chip at one side of the metal lead frame and a second cover part covering the other side of the metal lead frame. The second cover part has electrically conducting passages electrically connecting the coil contacts to the contact forming parts that are otherwise connected to the chip contacts. The chip carrying part and the first and second contact forming parts are electrically insulated with respect to each other and are arranged in a substantially coplanar relationship to each other.