Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

Abstract: A top loading cartridge is provided herein. The top loading cartridge includes a support member, a rail member, and a lock mechanism. The support member to receive an electronic module. The rail member attached to the support member to engage with a tray that receives the top loading server cartridge. The lock mechanism to lock the top loading cartridge.

Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

Abstract: A top loading cartridge is provided herein. The top loading cartridge includes a support member, a rail member, and a lock mechanism. The support member to receive an electronic module. The rail member attached to the support member to engage with a tray that receives the top loading server cartridge. The lock mechanism to lock the top loading cartridge.

Abstract: A top loading cartridge is provided herein. The top loading cartridge includes a support member, a rail member, and a lock mechanism. The support member to receive an electronic module. The rail member attached to the support member to engage with a tray that receives the top loading server cartridge. The lock mechanism to lock the top loading cartridge.

Abstract: A top loading cartridge is provided herein. The top loading cartridge includes a support member, a rail member, and a lock mechanism. The support member to receive an electronic module. The rail member attached to the support member to engage with a tray that receives the top loading server cartridge. The lock mechanism to lock the top loading cartridge.

Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

Abstract: A top loading cartridge is provided herein. The top loading cartridge includes a support member, a rail member, and a lock mechanism. The support member to receive an electronic module. The rail member attached to the support member to engage with a tray that receives the top loading server cartridge. The lock mechanism to lock the top loading cartridge.

Abstract: A top loading cartridge is provided herein. The top loading cartridge includes a support member, a rail member, and a lock mechanism. The support member to receive an electronic module. The rail member attached to the support member to engage with a tray that receives the top loading server cartridge. The lock mechanism to lock the top loading cartridge.

Abstract: A top loading cartridge is provided herein. The top loading cartridge includes a support member, a rail member, and a lock mechanism. The support member to receive an electronic module. The rail member attached to the support member to engage with a tray that receives the top loading server cartridge. The lock mechanism to lock the top loading cartridge.