Patents by Inventor Thomas Rossler

Thomas Rossler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Arrangement for heat dissipation
    Publication number: 20090067130
    Abstract: The invention relates to an arrangement for heat dissipation. The arrangement comprises a printed circuit board and at least one electrical and/or electronic component, with a power supply unit supplying electrical power to the electrical and/or electronic component (21). The power supply unit and the electrical and/or electronic component make electrical contact, and are thermally coupled. The power supply unit is also used for dissipation of thermal power losses from the electrical and/or electronic component.
    Type: Application
    Filed: February 18, 2006
    Publication date: March 12, 2009
    Inventors: Heiko Hahn, Bernhard Heigl, Thomas Rossler, Richard Wauschek, Thomas Michael