Abstract: A space vehicle is described. The space vehicle comprises one or more heat-producing components, and a closed loop cooling system configured to remove heat generated by the one or more heat-producing components. The closed loop cooling system comprises a coolant passageway defining a closed loop, a coolant located within the coolant passageway, the coolant comprising a static pressure of 100 pounds per square inch or lower and the coolant being in a single liquid phase through the coolant passageway, and one or more pumps configured to move the coolant through the coolant passageway. The closed loop cooling system further comprises a first heat exchange component disposed along the coolant passageway, the first heat exchange component configured to transfer heat from the heat-producing components to the coolant, and a second heat exchange component disposed along the coolant passageway, the second heat exchange component configured to remove heat from the coolant.

Abstract: A system includes a carrier defining a plurality of channels. The system includes an integrated circuit (IC) die having a first side and having a second side opposite the first side. The second side of the IC die is coupled to the carrier. The system includes a die attach layer between the carrier and the second side of the IC die. The die attach layer defines one or more openings that enable a fluid to flow from the carrier to the second side of the IC die.

Abstract: A system includes a carrier defining a plurality of channels. The system includes an integrated circuit (IC) die having a first side and having a second side opposite the first side. The second side of the IC die is coupled to the carrier. The system includes a die attach layer between the carrier and the second side of the IC die. The die attach layer defines one or more openings that enable a fluid to flow from the carrier to the second side of the IC die.

Abstract: In one aspect a satellite comprises a body, a solid state power amplifier, a heat acquisition and transfer device positioned proximate at least one heat generating element on the solid state power amplifier, and a heat rejection device in thermal communication with the heat acquisition and transfer device to reject heat acquired from the solid state power amplifier. Other aspects may be described.

Abstract: In one aspect a satellite comprises a body, a solid state power amplifier, a heat acquisition and transfer device positioned proximate at least one heat generating element on the solid state power amplifier, and a heat rejection device in thermal communication with the heat acquisition and transfer device to reject heat acquired from the solid state power amplifier. Other aspects may be described.

Abstract: There is provided an integrated articulating thermal isolation system having an articulating actuator assembly, a support frame assembly, and a thermal blanket assembly. The thermal blanket assembly has a pair of non-articulating blankets positioned on exterior surfaces of the support frame assembly and a pair of articulating blankets disposed between the non-articulating blankets. Each articulating blanket has a plurality of stiffener elements. The system further has a harness assembly, a deployable assembly interface element, and a vehicle interface element. When the articulating actuator assembly is actuated, the articulating blankets are guided by the support frame assembly from a stowed position to a deployed position through motion of the articulating actuator assembly.