Patents by Inventor Thomas S. Morris

Thomas S. Morris has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ultrathin flip-chip packaging techniques and configurations
    Patent number: 9269887
    Abstract: Embodiments include but are not limited to apparatuses and systems including microelectronic devices including a package substrate, a plurality of electronic components disposed on and electrically coupled with the package substrate at one or more sides of the package substrate, one or more hollow cavity sheet molds surrounding the plurality of electronic components and coupled with one or more sides of the package substrate, and a plurality of through-mold vias to couple the package substrate with an external surface of at least one of the one or more hollow cavity sheet molds. The microelectronic device may be a chip-scale package or module. Methods and systems for making the same also are described.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: February 23, 2016
    Assignee: TriQuint Semiconductor, Inc.
    Inventors: Frank J. Juskey, Robert C. Hartmann, Thomas S. Morris, Howard T. Glascock, Jose F. Ordonez