Abstract: A method for producing an adhesive tape by coating a carrier material in web form with a solvent-free adhesive composition, wherein immediately prior to the coating of the carrier material with the adhesive composition, the surface of the adhesive composition or the surface of the carrier material or the surface both of the adhesive composition and of the carrier material is heated by introduction of heat to a temperature of at least 30° C. above the processing temperature, has the effect that the adhesive composition is significantly better anchored on the carrier. For an adhesive tape produced in this way, a boost in the anchorage by up to 60% can be achieved. The penetration of the composition into carriers, especially rough carriers, can take place very much more easily under the conditions of the high temperatures and is controllable by means of the temperature regime.

Abstract: The invention relates to an easy-to-carry-out and effective method and a suitable device for absorbing permeates from flat structures. The method according to the invention comprises the following steps: gluing an adhesive tape containing at least one getter material onto the flat structure, storing the composite so obtained and consisting of the adhesive tape and the flat structure, and removing at least part of the adhesive tape which contains a getter material from the flat structure, the adhesive tape being designed to absorb at least partially at least one permeate from the flat structure. The invention further relates to an adhesive tape comprising at least one substrate layer having a water vapor permeation rate of <1 g/(m2*d) (measured according to ASTM F-1249 at 38° C.

Abstract: The invention relates to an easy-to-carry-out and effective method and a suitable device for absorbing permeates from flat structures. The method according to the invention comprises the following steps: gluing an adhesive tape containing at least one getter material onto the flat structure, storing the composite so obtained and consisting of the adhesive tape and the flat structure, and removing at least part of the adhesive tape which contains a getter material from the flat structure, the adhesive tape being designed to absorb at least partially at least one permeate from the flat structure. The invention further relates to an adhesive tape comprising at least one substrate layer having a water vapor permeation rate of <1 g/(m2*d) (measured according to ASTM F-1249 at 38° C.