Abstract: A method for measuring the relative local position error of one of the sections of an object that is exposed section by section, in particular of a lithography mask or of a wafer, is provided, each exposed section having a plurality of measurement marks, wherein a) a region of the object which is larger than the one section is imaged in magnified fashion and is detected as an image, b) position errors of the measurement marks contained in the detected image are determined on the basis of the detected image, c) corrected position errors are derived by position error components which are caused by the magnified imaging and detection being extracted from the determined position errors of the measurement marks, d) the relative local position error of the one section is derived on the basis of the corrected position errors of the measurement marks.

Abstract: In mask inspection, the defects that are of interest are primarily those that will also show up on wafer exposure. The aerial images generated in the resist and by emulation should be as identical as possible. This also applies to methods in which an overall structure that is divided into at least two substructures on at least two masks. A system and a method are provided for emulating a photolithographic process for generating on a wafer an overall structure that is divided into at least two substructures on at least two masks. The method includes generating aerial images of the at least two substructures, at least one of the aerial images being captured with a mask inspection microscope; correcting, by using a processing unit, errors in the at least one aerial image captured with a mask inspection microscope; and overlaying the aerial images of the at least two substructures to form an overall aerial image with the overall structure.

Abstract: The invention relates to a method and an apparatus for measuring masks for photolithography. In this case, structures to be measured on the mask on a movable mask carrier are illuminated and imaged as an aerial image onto a detector, the illumination being set in a manner corresponding to the illumination in a photolithography scanner during a wafer exposure. A selection of positions at which the structures to be measured are situated on the mask is predetermined, and the positions on the mask in the selection are successively brought to the focus of an imaging optical system, where they are illuminated and in each case imaged as a magnified aerial image onto a detector, and the aerial images are subsequently stored. The structure properties of the structures are then analyzed by means of predetermined evaluation algorithms. The accuracy of the setting of the positions and of the determination of structure properties is increased in this case.

Abstract: A method for verifying repairs on masks for photolithography is provided. A mask fabricated based on a mask layout is inspected for defects, and the positions at which defects are found on the mask are stored in a position file. In a repair step, the defects are repaired and, for each repaired position, in a verification step, an aerial image of the mask is taken at that position and the aerial image is analyzed to determine whether at that position the mask meets tolerance criteria established for one or more selected target parameters, and if the tolerance criteria have been met, the repair is verified. The verification can include a) based on the position file, a desired structure is defined in the mask layout at the repaired position, b) an aerial image is simulated for the desired structure, c) the captured aerial image is compared with the simulated one, and d) based on the comparison, a decision is made as to whether the repair at that position is verified.

Abstract: The invention relates to a method for analyzing a group of at least two masks for photolithography, wherein each of the masks comprises a substructure of a total structure, which is to be introduced in a layer of the wafer in the lithographic process, and the total structure is introduced in the layer of the wafer by introducing the substructures in sequence. In this method, a first aerial image of a first one of the at least two masks is recorded, digitized and stored in a data structure. Then, a second aerial image of a second one of the at least two masks is recorded, digitized and stored in a data structure. A combination image is generated from the data of the first and second aerial images, which combination image is represented and/or evaluated.

Abstract: Apparatus for inspecting objects especially masks in microlithography that are disposed in a vacuum chamber. The apparatus includes a converter for converting illuminating radiation emitted from the object into a radiation of a higher wavelength. A sensor for recording images is disposed outside the vacuum chamber and arranged as an optical interface from the vacuum chamber to the sensor of the converter or at least one part of an image lens is arranged as a window in the vacuum chamber.

Abstract: An optical imaging system for inspection microscopes with which lithography masks can be checked for defects particularly through emulation of high-aperture scanner systems. The microscope imaging system for emulating high-aperture imaging systems comprises imaging optics, a detector and an evaluating unit, wherein polarizing optical elements are selectively arranged in the illumination beam path for generating different polarization states of the illumination beam and/or in the imaging beam path for selecting different polarization components of the imaging beam, an optical element with a polarization-dependent intensity attenuation function can be introduced into the imaging beam path, images of the mask and/or sample are received by the detector for differently polarized beam components and are conveyed to the evaluating unit for further processing.

Abstract: Apparatus for inspecting objects especially masks in microlithography that are disposed in a vacuum chamber. The apparatus includes a converter for converting illuminating radiation emitted from the object into a radiation of a higher wavelength. A sensor for recording images is disposed outside the vacuum chamber and arranged as an optical interface from the vacuum chamber to the sensor of the converter or at least one part of an image lens is arranged as a window in the vacuum chamber.

Abstract: A polarizer device, for converting an entry light beam into an exit light beam with a defined spatial distribution of polarization states, has an angle varying input device for receiving the entry light beam and for generating a first light beam with a predeterminable first angular distribution of light rays; an angle-selectively active polarization influencing device for receiving the first light beam and for converting the first light beam into a second light beam according to a defined angle function of the polarization state variation; and an angle varying output device for receiving the second light beam and for generating the exit light beam with a second angular distribution from the second light beam. In particular, polarization states with a radial or tangential polarization can be provided cost-effectively in this way.

Abstract: The present invention is directed to an optical imaging system for inspection microscopes with which lithography masks can be checked for defects particularly through emulation of high-aperture scanner systems. The microscope imaging system for emulating high-aperture imaging systems comprises imaging optics, a detector and an evaluating unit, wherein polarizing optical elements are selectively arranged in the illumination beam path for generating different polarization states of the illumination beam and/or in the imaging beam path for selecting different polarization components of the imaging beam, an optical element with a polarization-dependent intensity attenuation function can be introduced into the imaging beam path, images of the mask and/or sample are received by the detector for differently polarized beam components and are conveyed to the evaluating unit for further processing.

Abstract: Imaging system for a microscope based on extreme ultraviolet (EUV) radiation. The present invention is directed to a reflective imaging system for an x-ray microscope for examining and object in an object plane, wherein the object is illuminated by rays of a wavelength of less than 100 nm, particularly less than 30 nm, and is imaged in a magnified manner in an image plane. In the imaging system, according to the invention, for a microscope based on extreme ultraviolet (EUV) radiation with wavelengths in the range of less than 100 nm, with a magnification of 0.1× to 1000× and a structural length of less than 5 m, at least one of the imaging optical elements 2 and 3 in the beam path has a diffractive-reflective structure which is arranged on a spherical or plane area and has a non-rotationally symmetric, asymmetric shape. The arrangement according to the invention provides an imaging system which avoids the disadvantages of the prior art and ensures a high imaging quality.

Abstract: The invention is directed to an arrangement for autofocusing onto a measuring location on an object moving in a direction which is at least approximately vertical to the optical axis of the imaging optics. According to the invention, a diaphragm device is to be provided the diaphragm opening of which extends in a direction aligned with the direction of movement of the measuring location; a receiving device for the measuring light has receiving areas arranged in a row beside each other and is inclined relative to the optical axis so that the image from the diaphragm device is incident on the receiving areas at an inclination of an angle &agr;; wherein the receiving device and the diaphragm opening are positioned relative to each other in such a way that characteristic measuring values are measured on the receiving areas when the measuring location is in or near the focus position.

Abstract: Imaging system for a microscope based on extreme ultraviolet (EUV) radiation. The present invention is directed to a reflective imaging system for an x-ray microscope for examining an object in an object plane, wherein the object is illuminated by rays of a wavelength of less than 100 nm, particularly less than 30 nm, and is imaged in a magnified manner in an image plane. In the imaging system, according to the invention, for a microscope based on extreme ultraviolet (EUV) radiation with wavelengths in the range of less than 100 nm, with a magnification of 0.1× to 1000× and a structural length of less than 5 m, at least one of the imaging optical elements 2 and 3 in the beam path has a diffractive-reflective structure which is arranged on a spherical or plane area and has a non-rotationally symmetric, asymmetric shape. The arrangement according to the invention provides an imaging system which avoids the disadvantages of the prior art and ensures a high imaging quality.

Abstract: The invention is directed to an arrangement for autofocusing onto a measuring location (M) on an object (O) moving in a direction (R) which is at least approximately vertical to the optical axis (A) of the imaging optics (3). According to the invention, a diaphragm device is to be provided the diaphragm opening of which extends in a direction (R′) aligned with the direction of movement (R) of the measuring location (M); a receiving device for the measuring light has receiving areas (e1, e2, . . . en) arranged in a row beside each other and is inclined relative to the optical axis so that the image from the diaphragm device is incident on the receiving areas (e1, e2, . . . en) at an inclination of an angle a; wherein the receiving device and the diaphragm opening are positioned relative to each other in such a way that characteristic measuring values are measured on the receiving areas when the measuring location (M) is in or near the focus position.

Abstract: A microscope comprises an illumination source, an optical imaging device by which light from the illumination source in the form of an illuminated field is directed onto an observed object, a reception device which receives the light influenced by the observed object in the from of an image field corresponding to the illuminated field, and a device for adjusting the distance between the imaging device and the observed object. Further, there is a device for structuring the illumination light in the beam path between the illumination source and the imaging device with two or more diaphragms spaced apart axially in the direction of the beam path. The diaphragms are arranged in such a way that a plane lying therebetween is focused in the image field on the reception device at the same time as the observed object. An evaluating device generates an actuating signal (s) for actuating the adjusting device depending on the intensities.

Abstract: An autofocus for a confocal microscope is realized by means of a confocal microscope arrangement comprising an illumination arrangement for illuminating an object in a raster pattern, first means for generating a first wavelength-selective splitting of the illumination light and second means for generating a second wavelength-selective splitting of the light coming from the object in a parallel manner for a plurality of points of the object, and detection means for detecting the light distribution generated by the second means, wherein an at least point-by-point spectral splitting and detection of an object image in a wavelength-selective manner is carried out and a control signal is generated from the determination of the frequency deviation and/or intensity deviation from a predetermined reference value corresponding to the object position in order to adjust the focal position by means of the vertical object position and/or the imaging system of the microscope.

Abstract: The invention is directed to an autofocusing device, preferably for microscopes for wafer inspection, in which a point-shaped illumination diaphragm (1) which is illuminated by laser light is imaged in an observed object (5). An image of the point illuminated on the observed object (5) is formed in a measurement diaphragm arrangement conjugate to the illumination diaphragm (1), the position of maximum intensity of this image is determined by a position-sensitive detector (11) and this position is compared to a position corresponding to the focus position, and an actuating signal for autofocusing is obtained from the deviation between the two positions.

Abstract: The invention is directed to an arrangement for confocal autofocusing of optical devices, preferably for fine focusing of microscopes, in which an illumination beam path is directed onto an observed object, and image information from the surface of the observed object as well as information about the focus position is obtained from the light that is reflected in an objective by the observed object and, based on this information, a correction of the focus position is carried out by means of an evaluating and adjusting unit. In a device of the type described herein, the image information and the information about the focus position are guided in different, spatially separated optical branches.

Abstract: A confocal microscope has a motorized scanning table for moving the sample perpendicularly to the optical axis of the microscope. The object is illuminated simultaneously at many places by means of a light source array. The light reflected or scattered at the object is detected by means of a diaphragm array, which is conjugate to the object and to the light source array. A sensor array is provided as a detector and makes a displacement of charges possible between individual positions in the scanning direction. The sensor is a so-called TDI sensor. The displacement of the charges is synchronized with the motion of the object corresponding to the motion of the image points in the plane of the sensor array. The image data can thereby be recorded during the motion of the object, so that even large object fields can be sensed in a short time with high lateral resolution.

Abstract: A microscope with incident light input coupling, wherein the light provided for the incident illumination is directed onto the partially reflecting layer of a beam splitter cube and is directed from there through the objective onto the specimen, while the light reflected and/or emitted by the specimen travels back to the partially reflecting layer and passes through the latter into the imaging beam path. In a microscope of this type, the beam splitter cube is provided with a negative spherical curvature at its outer surface facing the objective. Further, instead of the conventional tube lens, there is a combination formed of a converging lens and a diverging lens, wherein the surface curvatures of the converging lens and the diverging lens and the negative spherical curvature effected at the beam splitter cube are adapted to one another in such a way that the back-reflections of the incident illumination in the intermediate image plane are limited to a minimum.