Patents by Inventor Thomas Schiml

Thomas Schiml has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HANGING DIE-TO-DIE INTERCONNECT BRIDGE FOR INTERPOSER PACKAGES
    Publication number: 20260198336
    Abstract: Bridge die interposer packages, and related apparatuses, systems, and techniques are discussed. An interposer package includes a bridge die having a routing structure to interconnect multiple integrated circuit (IC) dies of the package. Power is provided to the IC dies by a mesh power supply metallization and a mesh ground metallization that extend from outside a perimeter of the bridge die to within the perimeter and over the routing structure. The bridge die may be absent through silicon vias (TSVs) and may be hanging such that it is exposed at the bottom of the package.
    Type: Application
    Filed: January 6, 2025
    Publication date: July 9, 2026
    Applicant: Intel Corporation
    Inventors: Bernd Waidhas, Michael Langenbuch, Peter Baumgartner, Joachim Stahl, Thomas Schiml, Sidharthi Palanisamy, Marko Milosevic
  • Semiconductor devices
    Patent number: 8242550
    Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. A preferred embodiment includes providing a workpiece having a first orientation and at least one second orientation. The semiconductor device is implanted with a dopant species using a first implantation process in the first orientation of the workpiece. The semiconductor device is implanted with the dopant species using a second implantation process in the at least one second orientation of the workpiece, wherein the second implantation process is different than the first implantation process.
    Type: Grant
    Filed: July 2, 2010
    Date of Patent: August 14, 2012
    Assignee: Infineon Technologies AG
    Inventors: Thomas Schiml, Manfred Eller
  • Semiconductor Devices
    Publication number: 20100264477
    Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. A preferred embodiment includes providing a workpiece having a first orientation and at least one second orientation. The semiconductor device is implanted with a dopant species using a first implantation process in the first orientation of the workpiece. The semiconductor device is implanted with the dopant species using a second implantation process in the at least one second orientation of the workpiece, wherein the second implantation process is different than the first implantation process.
    Type: Application
    Filed: July 2, 2010
    Publication date: October 21, 2010
    Inventors: Thomas Schiml, Manfred Eller
  • Semiconductor devices and methods of manufacture thereof
    Patent number: 7776726
    Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. A preferred embodiment includes providing a workpiece having a first orientation and at least one second orientation. The semiconductor device is implanted with a dopant species using a first implantation process in the first orientation of the workpiece. The semiconductor device is implanted with the dopant species using a second implantation process in the at least one second orientation of the workpiece, wherein the second implantation process is different than the first implantation process.
    Type: Grant
    Filed: May 4, 2006
    Date of Patent: August 17, 2010
    Assignee: Infineon Technologies AG
    Inventors: Thomas Schiml, Manfred Eller
  • Semiconductor devices and methods of manufacture thereof
    Publication number: 20070257327
    Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. A preferred embodiment includes providing a workpiece having a first orientation and at least one second orientation. The semiconductor device is implanted with a dopant species using a first implantation process in the first orientation of the workpiece. The semiconductor device is implanted with the dopant species using a second implantation process in the at least one second orientation of the workpiece, wherein the second implantation process is different than the first implantation process.
    Type: Application
    Filed: May 4, 2006
    Publication date: November 8, 2007
    Inventors: Thomas Schiml, Manfred Eller