Abstract: A multi-beam charged particle inspection system and a method of operating a multi-beam charged particle inspection system for wafer inspection with high throughput and with high resolution and high reliability comprise a mechanism for reduction and compensation of a scanning induced aberration, such as a scanning distortion of a collective multi-beam raster scanner for beamlets propagating at an angle with respect to the optical axis of the multi-beam charged particle inspection system.

Abstract: A multiple particle beam microscope and an associated method can provide a fast autofocus around an adjustable working distance. A system can have one or more fast autofocus correction lenses for adapting, in high-frequency fashion, the focusing, the position, the landing angle and the rotation of individual particle beams upon incidence on a wafer surface during the wafer inspection. Fast autofocusing in the secondary path of the particle beam system can be implemented in analogous fashion. An additional increase in precision can be attained via fast aberration correction mechanism in the form of deflectors and/or stigmators.

Abstract: The invention relates to a crash management system for a motor vehicle, the crash management system comprising a crossbeam for being connected to a body shell structure of the motor vehicle, the crossbeam comprising a front flange, a rear flange and at least two transverse walls connecting the front flange to the rear flange, at least one partition wall extending at least approximately parallel to the front flange and/or to the rear flange being disposed between the front flange and the rear flange the crash management system also comprising at least one dividing wall protruding from the front flange or the rear flange in the direction of the at least one partition wall and being connected to the at least one partition wall at a joint, said dividing wall separating two closed chambers from one another within the cross section of the crossbeam.

Abstract: A crash management system for a vehicle comprising an assembly of bumper cross members with at least a first bumper cross member and a second bumper cross member being substantially vertically spaced and located one above the other and at least one connecting means to attach the first bumper cross member and the second bumper cross member to the motor vehicle, and a two essentially side extensions positioned on each side of the crash management system. Each side extension comprises, a first vertical segment, a first and a second horizontal segment and at least one opening. The first horizontal segment overlaps the first bumper cross member and the second horizontal segment overlaps the second bumper cross member.

Abstract: The present invention relates to a prefabricated cable, to a cable plug connector arrangement, and to an electrical plug connection. A prefabricated cable (1) has a shielding foil (4), a shielding braid (5) which surrounds the shielding foil (4), and a cable sheath (6) which surrounds the shielding braid (5). The shielding braid (5) is exposed from the cable sheath (6) at a plug-side end (8) of the prefabricated cable (1). The shielding foil (4) has a dielectric foil (9) made of a dielectric material, and a metal coating (101, 102) on an outer lateral surface and on an inner lateral surface of the dielectric foil (9). The metal coating (101) on the outer lateral surface is electrically conductively connected to the metal coating (102) on the inner lateral surface in a plug-side end region (11) of the shielding foil (4) via at least one electrically conductive connection (12).

Abstract: A medical instrument, for example an impact instrument, and a method for producing a medical instrument. The medical instrument includes a proximal end and a distal end. A handle and a striking face facing in a proximal direction are arranged or formed on the proximal end. A tool instrument is arranged or formed on the distal end. An instrument shaft of the instrument extends from the proximal end to the tool element. The handle is configured in the form of a hollow handle.

Abstract: A multiple particle beam microscope and an associated method can provide a fast autofocus around an adjustable working distance. A system can have one or more fast autofocus correction lenses for adapting, in high-frequency fashion, the focusing, the position, the landing angle and the rotation of individual particle beams upon incidence on a wafer surface during the wafer inspection. Fast autofocusing in the secondary path of the particle beam system can be implemented in analogous fashion. An additional increase in precision can be attained via fast aberration correction mechanism in the form of deflectors and/or stigmators.

Abstract: A multi-beam charged particle beam system includes a detection unit configured for a dynamic compensation of charging effects of a sample. The detection unit comprises a relay optical system comprising an adaptive mirror array for keeping signal beams at the position of entrance apertures of lightguides od detection elements. Thereby, beam distortions induced by charging effects can be compensated. The disclosure can be applied to, for example, wafer inspection with multi-beam charged particle beam system.

Abstract: A multi-beam charged particle system with a secondary electron imaging system is configured to dynamically compensate charging effects. The multi-beam charged particle system comprises an improved cross-over detection system and a cross-over actuation mechanism, which are both connected to a contrast control module. The system allows for closed-loop control of an intensity distribution of a plurality of secondary electron beamlets within a cross-over or pupil plane. The disclosure can be applied to wafer inspection with multi-beam charged particle system.

Abstract: A method for designing a multi-beam particle microscope and a multi-beam particle microscope operating with a multiplicity of charged individual particle beams and imaging the latter into an object plane and comprising a plurality of path trajectory correction plates are disclosed. Each of the path trajectory correction plates has a multiplicity of apertures for the multiplicity of individual particle beams and exactly one settable correction voltage is applied to each of the path trajectory correction plates during the operation of the multi-beam particle microscope. A path trajectory correction plate is fixedly assigned to an operating parameter of the multi-beam particle microscope. When designing the path trajectory correction plates, the apertures in the path trajectory correction plates are adapted in view of shape and size such that operating parameter-related path deviations of all individual particle beams can be corrected.

Abstract: A multi-beam generator for a charged-particle multi-beam system comprises: a stack of multi-aperture plates with at least a first multi-lens array for long range focal length variation; and a second multi-lens array for short range focal length variation. Aperture diameters of the first multi-lens array vary to encode a pre-compensation of a spherically curved image field in an object plane of the multi-beam system. Aperture diameters of the second multi-lens array vary to encode a pre-compensation of a residual image field error in the object plane which is not pre-compensated by the first multi-lens array. The control unit of the multi-beam generator provides driving voltages to the first and second lens arrays based on the current working point of the charged-particle multi-beam system.

Abstract: Various examples generally pertain to closed-loop control of one or more parameters of a multi-beam charged particle imaging system, e.g., a multi beam scanning electron microscope, mSEM. A pattern of secondary beamlets can be stabilized. A focal position can be stabilized. According to examples, fast algorithms are facilitated by a field-programmable gated array, FPGA, logic.

Abstract: The invention relates to a method for winding a cable winch, in which method a plurality of cable winding layers is wound one over the other, a plurality of cables being wound, in multiple strands, onto the same winding region of the cable winch such that the cables are adjacent to each other in the same cable winding layer.

Abstract: A multi-beam charged particle beam system with a secondary electron imaging system is configured to dynamically compensate charging effects of a sample over a large range of landing energies of primary charged particles. The multi-beam charged particle beam system has reduced complexity and comprises a fast electrostatic lens element and a mechanism for compensating charging effects. The mechanism can be a second fast electrostatic lens element or a position actuator. The technology can used in wafer inspection with multi-beam charged particle beam system.

Abstract: A power module includes: a substrate having a patterned metallization on an electrically insulative body; a plurality of first power semiconductor dies attached to a first metallic island of the patterned metallization; a plurality of second power semiconductor dies attached to a second metallic island of the patterned metallization; a mold compound at least partly embedding the substrate, the first power semiconductor dies, and the second power semiconductor dies; and a multilevel metallic frame partly embedded in the mold compound and disposed over the substrate. The multilevel metallic frame includes a plurality of power terminals exposed at a side of the mold compound that faces away from the patterned metallization and that transition between two or more different levels to electrically interconnect the first power semiconductor dies and the second power semiconductor dies in a half bridge or full bridge configuration.

Abstract: A power module includes: a first substrate having a patterned first metallization; a second substrate vertically aligned with the first substrate and having a patterned second metallization that faces the patterned first metallization; first vertical power transistor dies having a drain pad attached to a first island of the patterned first metallization and a source pad electrically connected to a first island of the patterned second metallization via first spacers; and second vertical power transistor dies having a source pad electrically connected to the first island of the patterned first metallization via second spacers. A first subset of the second vertical power transistor dies has a drain pad attached to a second island of the patterned second metallization. A second subset of the second vertical power transistor dies has a drain pad attached to a third island of the patterned second metallization. A method of producing the module is described.

Abstract: A multi-beam charged particle system and a method of operating a multi-beam charged particle system can provide improved image contrast. The multi-beam charged particle system comprises a filter element or an active array element in a detection system, which can provide improved, anisotropic image contrast. The disclosure can be applied for applications of multi-beam charged particle system, where higher desired beam uniformity and throughput may be relevant.

Abstract: A particle-optical arrangement includes a magnet arrangement for separating a primary and a secondary particle-optical beam path. The magnet arrangement includes: a first magnetic field region through which the primary particle-optical beam path and the second particle-optical beam path pass, for the separation of the primary particle-optical beam path and the secondary particle-optical beam path from one another; a second magnetic field region arranged in the primary particle-optical beam path and not arranged in the secondary particle-optical beam path; and a third magnetic field region arranged in the primary particle-optical beam path and not arranged in the secondary particle-optical beam path.

Abstract: A multi-beam charged particle system can have reduced field curvature. The multi-beam charged particle system can comprise a charged particle mirror element for compensating a field curvature of charged particle imaging elements. The charged particle mirror element can be configured for generating during use a virtual reflection surface of curved shape for reflecting primary charged particles. The disclosure can be applied for applications of multi-beam charged particle system, where higher beam uniformity and throughput are desired.

Abstract: A power module includes a substrate, one or more semiconductor dies mounted to the substrate, a first external power connection electrically connected to a first power terminal of at least one of the one or more semiconductor dies, and an encapsulant at least partially encapsulating the first external power connection. A portion of the first external power connection and at least parts of an outer surface of the substrate are exposed from the encapsulant. A heatsink is mounted to the first external power connection.