Abstract: An edge connector for coplanar coupling of two printed circuit boards (PCBs) comprises an elongated body and two end structures. The elongated body has a compression contact space and two PCB contact surfaces, each PCB contact surface having a plurality of contact positions. Portions of compression contacts positioned in the compression contact space extend through contact positions on both PCB contact surfaces. When a PCB edge surface contacts a PCB contact surface of the elongated body, an edge connection on the PCB edge surface contacts a compression contact, forming an electrical connection. Each end structure has two contact pairs, wherein each contact pair has attaching features that couple the edge connector to a PCB to maintain the electrical connection. When two PCBs are coupled to the edge connector, the compression contacts form electric paths for conducting power and/or communication between the two PCBs.

Abstract: Ranks of one or more memory modules can have variable data widths. As part of initializing a memory architecture, a memory controller can be configured to detect the data width of the ranks in the memory architecture. Based on the detected data widths of the ranks, the memory controller can synchronize the clocks and chip select signals of multiple ranks to thereby cause one or more memory chips in each of the multiple ranks to be connected to the shared data lines at the same time.

Abstract: Removeable couplings are provided for connecting a memory module to a host processor of an IHS (Information Handling System). The coupling includes electrical contacts and fasteners for positioning the electrical contacts within an empty memory slot of the IHS motherboard. The housing extends between two ends of the coupling and receives the memory module when the memory module is installed in the IHS. The positioned electrical contacts are then seated within the memory slot of the motherboard by the downward force applied by an administrator in installing the memory module to the coupling. The force applied in installing the memory module also serves to connect the electrical contacts of the coupling to a memory channel of the motherboard. The removeable coupling is not attached to the motherboard when the memory module is not installed in the IHS, thus eliminating signal stubs in the memory channel.

Abstract: A memory module includes a printed circuit board and a Low-Power Double Data Rate (LPDDR) memory device. The printed circuit board includes surface contact connections on a first surface of the printed circuit board and located at a first portion of the printed circuit board. The LPDDR memory device is on a second surface of the printed circuit board and located at a second portion of the printed circuit board. The LPDDR memory device is configured to be coupled to an information handling system via the surface contact connections. The second portion of the printed circuit board is adjacent to the first portion of the printed circuit board.

Abstract: Embodiments of systems and methods for a Compression Attached Memory Module (CAMM) for Low-Power Double Data Rate (LPDDR) memories are described. In an illustrative, non-limiting embodiment, an Information Handling System (IHS) may include: a compression Dual In-Line Memory Module (cDIMM) connector coupled to a motherboard; and a memory module coupled to the cDIMM connector, where the memory module comprises an LPDDR device coupled to a top surface of the memory module and accessible via surface contact connections disposed on a bottom surface of the memory module.

Abstract: An edge connector for coplanar coupling of two printed circuit boards (PCBs) comprises an elongated body and two end structures. The elongated body has a compression contact space and two PCB contact surfaces, each PCB contact surface having a plurality of contact positions. Portions of compression contacts positioned in the compression contact space extend through contact positions on both PCB contact surfaces. When a PCB edge surface contacts a PCB contact surface of the elongated body, an edge connection on the PCB edge surface contacts a compression contact, forming an electrical connection. Each end structure has two contact pairs, wherein each contact pair has attaching features that couple the edge connector to a PCB to maintain the electrical connection. When two PCBs are coupled to the edge connector, the compression contacts form electric paths for conducting power and/or communication between the two PCBs.

Abstract: An information handling system includes a first z-axis compression connector, a first dual in-line memory module (DIMM), a second z-axis compression connector, a second DIMM, and a printed circuit board. A first side of the first compression connector is affixed to the printed circuit board. A first surface of a first memory circuit board of the first DIMM is affixed to a second side of the compression connector. A first side of the second compression connector is affixed to a second side of the first memory circuit board. A first side of a second memory circuit board of the second DIMM is affixed to a second side of the second compression connector. The first compression connector has a first depth, and the second compression connector has a second depth that is different from the first depth.

Abstract: A system and method of implementing an adaptable graphics board form factor design comprising an adaptable graphics board including a reconfigurable zone subset of components including a reconfigurable I/O module having display data ports disposed along a first edge of the adaptable graphics board, the adaptable graphics board including a set of core components including the graphics processor and graphics memory, wherein the reconfigurable zone subset of components are orientable relative to the set of core components to interface with an information handling system chassis of a first model specification selected from a plurality of model specifications for information handling systems in which the adaptable graphics board may be used, and the adaptable graphics board including a connector pad interface area for receiving an array of compressible electrical spring contacts of a compression jumper pad for a flexible compression jumper connector, wherein the connector pad interface area is disposed along a sec

Abstract: Ranks of one or more memory modules can have variable data widths. As part of initializing a memory architecture, a memory controller can be configured to detect the data width of the ranks in the memory architecture. Based on the detected data widths of the ranks, the memory controller can synchronize the clocks and chip select signals of multiple ranks to thereby cause one or more memory chips in each of the multiple ranks to be connected to the shared data lines at the same time.

Abstract: A memory module mounting apparatus for coupling a memory module to a processor of an information handling system includes a z-axis compression connector and a compression connector mount. The z-axis compression connector has first compression contacts on a first surface of the compression connector and second compression contacts on a second surface of the compression connector. The first compression contacts couple the compression connector to the processor. The compression connector mount has contact pads on a first surface of the compression connector mount. The first contact pads couple the compression connector mount to the first compression contacts, and have contact elements configured to couple the contact pads to the memory module.

Abstract: Removeable couplings are provided for connecting a memory module to a host processor of an IHS (Information Handling System). The coupling includes electrical contacts and fasteners for positioning the electrical contacts within an empty memory slot of the IHS motherboard. The housing extends between two ends of the coupling and receives the memory module when the memory module is installed in the IHS. The positioned electrical contacts are then seated within the memory slot of the motherboard by the downward force applied by an administrator in installing the memory module to the coupling. The force applied in installing the memory module also serves to connect the electrical contacts of the coupling to a memory channel of the motherboard. The removeable coupling is not attached to the motherboard when the memory module is not installed in the IHS, thus eliminating signal stubs in the memory channel.

Abstract: Information handling system (IHS) heatsinking systems and methods may employ a thermally conductive compression attached memory module (CAMM) bolster plate affixed to one surface of a circuit board of the CAMM, between a central processing unit (CPU) of the IHS and memory devices mounted on the CAMM, to provide compression between the CAMM and a z-axis compression connector and to capture and dissipate heat from the CPU and the memory devices. Spacing between the CPU and the DIMM may enable this capture and dissipation of heat from the CPU. The bolster plate may be configured to receive at least one conductive fastener that bears on the bolster plate and presses the CAMM to the z-axis compression connector, and to conductively thermally couple the CAMM and bolster plate to a ground plane of a system printed circuit board (PCB) mounting the CPU and the CAMM.

Abstract: An information handling system includes a printed circuit board, a z-axis compression connector, and a compression attached memory module (CAMM). The compression connector coupled receives a first memory channel and a second memory channel from the PCB. The CAMM receives the first memory channel and the second memory channel from the first compression connector. The CAMM is configured to provide memory transaction on only the first memory channel.

Abstract: A compression attached memory module (CAMM) includes a memory device, a first array of compression contact pads and a second array of compression contact pads. The first array of compression contact pads receives a first memory channel and a second memory channel. The first memory channel is coupled to the first memory device. The second array of compression contact pads is coupled to a subset of the first compression contact pads associated with the second memory channel.

Abstract: An information handling system includes a first z-axis compression connector having a first depth, a first memory module, a second z-axis compression connector having a second depth that is greater than the first depth, a second memory module, and a printed circuit board. A first side of the first compression connector is affixed to the printed circuit board at a first location and a first surface of a first memory circuit board of the first memory module is affixed to a second side of the first compression connector. A first side of the second compression connector is affixed to the printed circuit board at a second location adjacent to the first location and the first side of a second memory circuit board of the second memory module is affixed to a second side of the second compression connector.

Abstract: A z-axis compression connector includes a plurality of high-speed signal contacts arranged in a grid of M rows by N columns, and a plurality of signal return contacts arranged between the N columns. A first signal return contact is positioned mid-way in line between a first signal contact and a second signal contact, where the first signal contact is in a first row and a first column and the second signal contact is in the first row and a second column adjacent to the first column.

Abstract: A vent for reduced airflow impedance and increased electromagnetic interference (EMI) shielding for an information handling system. The vent comprises two plates, wherein each plate comprises a plurality of structures. Each structure has a base opening with a first set of dimensions, a contact area with a second set of dimensions smaller than the first set of dimensions, and a wall extending at an angle from the base opening to the contact area. Each wall has a plurality of holes to increase the open percentage of the vent for decreased airflow impedance, which allows more airflow through the vent. The reduced size of each hole, the angled walls and continuous surface areas between adjacent structures reduce the amount of electromagnetic energy that can pass through the vent.

Abstract: An information handling system includes a first z-axis compression connector, a first dual in-line memory module (DIMM), a second z-axis compression connector, a second DIMM, and a printed circuit board. A first side of the first compression connector is affixed to the printed circuit board. A first surface of a first memory circuit board of the first DIMM is affixed to a second side of the compression connector. A first side of the second compression connector is affixed to a second side of the first memory circuit board. A first side of a second memory circuit board of the second DIMM is affixed to a second side of the second compression connector. The first compression connector has a first depth, and the second compression connector has a second depth that is different from the first depth.

Abstract: An information handling system includes a first z-axis compression connector, a first dual in-line memory module (DIMM), a second z-axis compression connector, a second DIMM, and a printed circuit board. A first side of the first compression connector is affixed to the printed circuit board. A first surface of a first memory circuit board of the first DIMM is affixed to a second side of the compression connector. A first side of the second compression connector is affixed to a second side of the first memory circuit board. A first side of a second memory circuit board of the second DIMM is affixed to a second side of the second compression connector. The first compression connector has a first depth, and the second compression connector has a second depth that is different from the first depth.