Abstract: The invention relates to a control unit (10; 10a to 10d), particularly for vehicle navigation, having a housing (13) that consists of at least two housing elements (11, 12; 61, 65, 72; 75), having at least one circuit carrier (16; 16a; 64; 81) on which at least one heat-generating component (1) is arranged, having a thermal transfer element (30; 61), made of metal, for dissipating the heat generated by the at least one heat-generating component (1), having at least one sensor element (40, 41) that is connected at least indirectly to the at least one circuit carrier (16; 16a; 64; 81), having at least one plug connection body (35), made of plastic, having connection elements (36) for making electrical contact with the at least one circuit carrier (16; 16a; 64; 81), wherein the plug connection body (35) is formed in the region of a frame-like or cover-like housing element (12; 65;75), made of plastic, so as to be integral therewith or as a component that is separate from the housing element (12; 65; 75).

Abstract: The invention relates to an electronic controller (10), having a housing (11), which is preferably made of plastic, having at least one high-frequency connection (14, 15), wherein the high-frequency connection (14, 15) has at least two elements (18; 18a; 18b; 18d, 20; 20a; 20b; 20c; 20d) that form a high-frequency conductor (19), for transmitting a high-frequency signal, and a screening element (21), wherein the two elements (18; 18a; 18b; 18d, 20; 20a; 20b; 20c; 20d) of the high-frequency connection (14, 15) are connectable to a circuit carrier (25) in the interior of the housing (11), and wherein the two elements (18; 18a; 18b; 18d, 20; 20a; 20b; 20c; 20d) of the high-frequency connection (14, 15) are formed on the side facing the circuit carrier (25) in the form of press-in pins (28; 28b; 28d, 29; 29b; 29c; 29d, 51).

Abstract: The invention relates to a control unit (10; 10a to 10d) having a housing (13), which consists of at least two housing elements (11, 12; 61, 65, 72; 75), and having at least two circuit carriers (16; 16a, 17; 17a; 64; 81, 82), wherein the first circuit carrier (16; 16a; 64; 81) is designed for accommodating at least one heat-generating component (1) and the second circuit carrier (17; 17a; 82) is designed for accommodating at least one sensor element (40, 41), wherein the two circuit carriers (16; 16a, 17; 17a; 64; 81, 82) are connected electrically to one another, and wherein the second circuit carrier (17; 17a; 82) is provided with vibration-damping means (45; 53, 54; 85), which serve to reduce vibrations transmitted to the second circuit carrier (17; 17a; 82) via the housing (13).

Abstract: The invention relates to a control unit (10; 10a to 10d), particularly for vehicle navigation, having a housing (13) that consists of at least two housing elements (11, 12; 61, 65, 72; 75), having at least one circuit carrier (16; 16a; 64; 81) on which at least one heat-generating component (1) is arranged, having a thermal transfer element (30; 61), made of metal, for dissipating the heat generated by the at least one heat-generating component (1), having at least one sensor element (40, 41) that is connected at least indirectly to the at least one circuit carrier (16; 16a; 64; 81), having at least one plug connection body (35), made of plastic, having connection elements (36) for making electrical contact with the at least one circuit carrier (16; 16a; 64; 81), wherein the plug connection body (35) is formed in the region of a frame-like or cover-like housing element (12; 65;75), made of plastic, so as to be integral therewith or as a component that is separate from the housing element (12; 65; 75).

Abstract: A method for producing a sensor module, in which a line part is provided in a first production step, which includes at least one receiving region for the force-fitting and/or form-fitting accommodation of a sensor element, and in a second production step for producing a housing, the line part is extrusion-coated with a plastic material in such a way that the at least one receiving region remains generally free of plastic material, and the sensor element is fixed in place in force-fitting and/or form-fitting manner in the at least one receiving region in a third production step.

Abstract: An electronic component having a molded component housing and an electrically conductive insert part embedded in the component housing for contacting a micro component, the insert part having an accommodating area for accommodating the micro component with a subarea, which is spaced apart from the micro component, for decoupling the micro component from material stresses of the component housing. A method for manufacturing an electronic component having a molded component housing, an electrically conductive insert part for contacting a micro component being embedded in the component housing, a subarea, which is spaced apart from the micro component, decoupling the micro component from material stresses of the component housing, during curing of the housing material, in an accommodating area for accommodating the micro component on the insert part.

Abstract: An electronic component having a molded component housing and an electrically conductive insert part embedded in the component housing for contacting a micro component, the insert part having an accommodating area for accommodating the micro component with a subarea, which is spaced apart from the micro component, for decoupling the micro component from material stresses of the component housing. A method for manufacturing an electronic component having a molded component housing, an electrically conductive insert part for contacting a micro component being embedded in the component housing, a subarea, which is spaced apart from the micro component, decoupling the micro component from material stresses of the component housing, during curing of the housing material, in an accommodating area for accommodating the micro component on the insert part.

Abstract: A method for producing a sensor module, in which a line part is provided in a first production step, which includes at least one receiving region for the force-fitting and/or form-fitting accommodation of a sensor element, and in a second production step for producing a housing, the line part is extrusion-coated with a plastic material in such a way that the at least one receiving region remains generally free of plastic material, and the sensor element is fixed in place in force-fitting and/or form-fitting manner in the at least one receiving region in a third production step.

Abstract: A sensor module has an electrically conductive part, a first sensor element, and a second sensor element, the first sensor element being situated in a first accommodating area of the conductive part, and the second sensor element being situated in a second accommodating area of the conductive part, and the conductive part furthermore having a bent area situated between the first and the second accommodating areas so that the second accommodating area is oriented at an angle with respect to the first accommodating area.