Abstract: A chip arrangement including a chip module which includes a chip, a contact-based interface in accordance with ISO 7816 which is electrically conductively connected to the chip, and an antenna structure which is electrically conductively connected to the chip and provides a contactless interface, and a carrier which comprises a chip module receptacle and a booster antenna structure which, when the chip module is arranged in the chip module receptacle of the carrier, inductively couples to the antenna structure of the chip module, wherein the chip module is arranged releasably in the chip module receptacle.

Abstract: A chip-interconnect arrangement including a substrate having a cavity, a chip having at least one chip contact and one chip contact surface, the chip being arranged in the cavity, an interconnect having an interconnect surface, the interconnect being applied on a surface of the substrate, and an electrically conductive adhesion medium, which electrically connects the at least one chip contact to the interconnect, wherein the interconnect surface is planar.

Abstract: A smart card module including a contact region with at least one electrical smart card module contact, and a verification code display unit configured to display a verification code, the verification code display unit being arranged in the smart card module, wherein the verification code display unit is configured as a dynamic permanent display unit, the controlled display of which continues to be displayed after deenergization of the verification code display unit.

Abstract: A sensor device is provided that includes a fingerprint sensor and an antenna coupled with the fingerprint sensor for inductive coupling of the fingerprint sensor with a booster antenna.

Abstract: A method for producing a document structure, wherein the method includes producing a chip structure by forming a cavity in a carrier having a top side and an under side, picking up a chip having at least one chip contact and a redistribution layer (RDL) connected to the at least one chip contact by means of a picking-up device detaching the chip from an auxiliary carrier, wherein the chip bears on the auxiliary carrier by way of the RDL, wherein the chip is lifted up from the auxiliary carrier by means of pressure being exerted on the RDL, wherein the lifted-up chip is picked up and inserted into the cavity, and wherein the RDL is oriented on the top side of the carrier, fixing the chip in the cavity by means of an adhesive, electrically conductively connecting the at least one chip contact of the RDL to an electrically conductive region of the carrier by means of an electrically conductive material, and embedding the carrier between a first paper layer and a second paper layer.

Abstract: A chip module having a chip coupled to at least one electrically conductive region including a metal, and a coating of the at least one electrically conductive region with a layer of at least one organic silicon compound and/or a form of carbon in a thickness having an electrical surface contact resistance of not more than 500 m? according to ISO 7810 in a measurement in accordance with ISO 10373-1.

Abstract: A device for an electronic cigarette. The device includes an enveloping element defining an interior, and an authentication device arranged in or on the enveloping element. The authentication device includes a planar loop antenna, and an authentication logic coupled to the planar loop antenna and configured to provide an authentication of the device vis-à-vis a control element of the electronic cigarette. The planar loop antenna is arranged in rolled form in the interior of the enveloping element or on the exterior of the enveloping element. The loop antenna comprises conduction sections in two opposite regions of the planar loop antenna, which extend in the longitudinal direction of the rolled loop antenna. The conduction sections of the opposite regions are arranged such that they are adjacent or overlap one another, with a result that their respective fields mutually compensate for one another at least partly.

Abstract: A set of devices is provided for an electronic cigarette. The set of devices has a first device and a second device, wherein the first device has an authentication device which is configured to authenticate the first device and the second device in relation to a control element of the electronic cigarette. The set of devices further has an identifier which indicates that the first device has the authentication device for authenticating the first device and the second device, wherein the second device is without an identifier which indicates that the second device has the authentication device for authenticating the first device and the second device.

Abstract: An electronic inhalation apparatus including a body having a chip module accommodating region which is at least partially surrounded by a folding structure which, when a chip module is accommodated in the chip module accommodating region, is bent around the chip module in order to fasten the chip module.

Abstract: A chip card having a chip card body with a first recess, and a chip module arranged in the recess, wherein the chip module is arranged with a distance of at most 20 ?m between the chip module surface facing the bottom of the recess and the bottom of the recess, wherein the chip card body has a layer thickness from the bottom of the recess up to a surface of the chip card body facing away from the bottom of the recess of at least 200 ?m.

Abstract: A sensor device is provided that includes a fingerprint sensor and an antenna coupled with the fingerprint sensor for inductive coupling of the fingerprint sensor with a booster antenna.

Abstract: In various exemplary embodiments, a smart card module is provided. The smart card module includes a carrier and a layer stack at least partly covering the carrier. The layer stack includes a reflection layer, a light-transmissive layer arranged above the reflection layer, and a partly light-transmissive silver layer arranged above the light-transmissive layer. The partly light-transmissive silver layer is configured for reflecting part of light impinging on the partly light-transmissive silver layer.

Abstract: A method for producing a smart card module arrangement includes: arranging a smart card module on a first carrier layer, wherein the first carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module. The smart card module includes: a substrate; a chip on the substrate; a first mechanical reinforcement structure between the chip and the substrate. The first mechanical reinforcement structure covers at least one part of a surface of the chip. The method further includes applying a second carrier layer to the smart card module, wherein the second carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module; and at least one of laminating or pressing the first carrier layer with the second carrier layer, such that the smart card module is enclosed by the first carrier layer and the second carrier layer.

Abstract: In various embodiments, a smart card module is provided. The smart card module may include an electronic circuit in or on a carrier, a smart card module contact layer, which is coupled to the electronic circuit and provides a plurality of smart card module contacts, a mirror layer on the smart card module contact layer, said mirror layer at least partly covering the smart card module contacts, and an optically translucent, electrically conductive oxide layer, which covers the mirror layer. The optically translucent, electrically conductive oxide layer includes a plurality of regions of different layer thicknesses for providing different color components.

Abstract: In various exemplary embodiments, a smart card module is provided. The smart card module includes a carrier and a layer stack at least partly covering the carrier. The layer stack includes a reflection layer, a light-transmissive layer arranged above the reflection layer, and a partly light-transmissive silver layer arranged above the light-transmissive layer. The partly light-transmissive silver layer is configured for reflecting part of light impinging on the partly light-transmissive silver layer.

Abstract: A chip card module arrangement may include a first surface and a second surface, which are opposite from one another, and a chip receptacle for one or more semiconductor chips on the surfaces. The chip card module arrangement may further include a connecting material receiving area on one of the two surfaces, the connecting material receiving area only taking up a portion of the surface.

Abstract: An electronic identification document is provided. The electronic identification document may include a carrier, an identification element, a microwave interaction structure configured to interact with microwave radiation, and an alteration element, wherein the alteration element may be part of or in contact with the microwave interaction structure and may be configured to alter, upon interaction of the interaction structure with microwaves, its state from an initial state to a permanent altered state, wherein the permanent altered state may differ from the initial state by a change of the alteration element in color, brightness, saturation, and/or transparency.

Abstract: In various embodiments, a method for manufacturing a chip arrangement, the method including bonding a microphone chip to a first carrier, the microphone chip including a microphone structure, depositing adhesive material laterally disposed from the microphone structure, and arranging the microphone structure into a cavity of a second carrier such that the adhesive material fixes the microphone chip to the cavity of the second carrier.

Abstract: In various embodiments, a smart card module is provided. The smart card module may include an electronic circuit in or on a carrier, a smart card module contact layer, which is coupled to the electronic circuit and provides a plurality of smart card module contacts, a mirror layer on the smart card module contact layer, said mirror layer at least partly covering the smart card module contacts, and an optically translucent, electrically conductive oxide layer, which covers the mirror layer. The optically translucent, electrically conductive oxide layer includes a plurality of regions of different layer thicknesses for providing different color components.