Patents by Inventor Thomas Stoeck

Thomas Stoeck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package
    Patent number: 10727151
    Abstract: A semiconductor chip package includes an electrically conducting carrier and a semiconductor chip disposed over the electrically conducting carrier. The semiconductor chip has a first surface facing the electrically conducting carrier and a second surface opposite the first surface. A metal plate has a first surface mechanically connected to the second surface of the semiconductor chip and a second surface opposite the first surface of the metal plate. The metal plate completely overlaps the second surface of the semiconductor chip. The second surface of the metal plate is at least partially exposed at a periphery of the semiconductor chip package.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: July 28, 2020
    Assignee: Infineon Technologies AG
    Inventors: Liu Chen, Teck Sim Lee, Jia Yi Wong, Wei Han Koo, Thomas Stoeck, Gilles Delarozee