Patents by Inventor Thomas T. Ngo

Thomas T. Ngo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and methods for enhancing signaling bandwidth in an integrated circuit package
    Patent number: 10880991
    Abstract: Embodiments described herein provide an electronic device having an integrated circuit disposed in a surface mount package. The surface mount integrated circuit package comprises a first pin and a second pin of the integrated circuit configured to couple the integrated circuit to a first terminal and a second terminal disposed on a circuit board. The first pin and second pin define a first connector and a second connector of a differential connector pair in the surface mount integrated circuit package for transferring differential signals from the integrated circuit to the circuit board. The surface mount integrated circuit package comprises an isolation stud disposed between the first pin and the second pin. The isolation stud is disconnected from the integrated circuit and configured to enlarge a gap between the first pin and the second pin relative to respective gaps of other pins coupling the electronic device to the circuit board.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: December 29, 2020
    Assignee: Marvell Asia Pte, Ltd.
    Inventors: Thomas T. Ngo, Xinlei Ding, Dance Wu, Chengchih Shih, Zhiqiang Li
  • APPARATUS AND METHODS FOR ENHANCING SIGNALING BANDWIDTH IN AN INTEGRATED CIRCUIT PACKAGE
    Publication number: 20190313523
    Abstract: Embodiments described herein provide an electronic device having an integrated circuit disposed in a surface mount package. The surface mount integrated circuit package comprises a first pin and a second pin of the integrated circuit configured to couple the integrated circuit to a first terminal and a second terminal disposed on a circuit board. The first pin and second pin define a first connector and a second connector of a differential connector pair in the surface mount integrated circuit package for transferring differential signals from the integrated circuit to the circuit board. The surface mount integrated circuit package comprises an isolation stud disposed between the first pin and the second pin. The isolation stud is disconnected from the integrated circuit and configured to enlarge a gap between the first pin and the second pin relative to respective gaps of other pins coupling the electronic device to the circuit board.
    Type: Application
    Filed: October 31, 2018
    Publication date: October 10, 2019
    Inventors: Thomas T. Ngo, Xinlei Ding, Dance Wu, Chengchih Shih, Zhiqiang Li