Abstract: Novel polyamide hot melt adhesive compositions are disclosed together with a novel method of preparation. The process of the invention comprises condensation of hexamethylene diamine with an acid mixture of specific aliphatic C.sub.19 dicarboxylic acids, aliphatic C.sub.6 -C.sub.10 dicarboxylic acids and a specific class of C.sub.2 -C.sub.27 monocarboxylic acids. The process is carried out initially in aqueous solvent and in the presence of a catalyst selected from phosphoric acid, magnesium oxide and calcium oxide. The adhesive compositions are particularly useful in adhering poromerics such as natural and synthetic leather goods. The compositions of the invention are also useful adhesives for adhering metals.