Abstract: A card reader includes a body including a slot that is configured to receive a swipe of a card along a first axis with an edge of the card abutting a bottom surface of the slot, the slot including at least one region that is configured to increase frictional drag on the card in response to a longitudinal axis of the card varying from parallel to the bottom surface of the slot; and a reader interface positioned in the body and configured to read a magnetic stripe on the card as the card is swiped through the slot along the first axis.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for modulating card information between a card reader and a user device. One of the methods includes receiving, from a read head of the card reader, card information associated with a card. The card information is encoded in a first format to be sent to the user device at a first data rate. The card information is encoded in a second format to be sent to the user device at a second data rate lower than the first data rate. The card information is sent to the user device encoded in the first format and the second format.

Abstract: Aspects of the subject disclosure provide a card reader for receiving payment card information at a mobile point-of-sale terminal. In some implementations, a reader of the subject technology can include a memory, a conditioning module and a 3.5 mm audio plug including an audio bus that is configured for insertion into a headphone port of a host device, such as a smart phone or tablet computer. Implementations of the subject technology also include a microprocessor configured to perform operations for receiving a training sequence for use in determining communication parameters associated with a mobile device, and in response to the training sequence, transmitting an acknowledgement signal to the mobile device, via the audio bus, to indicate that a communicative coupling with the mobile device has been successfully established.

Abstract: Read head array stitching techniques are described. A card reader includes an array of magnetic sensors (a read head array) for retrieving account information from a magnetic stripe of a financial transaction card. The magnetic sensors can be arranged in rows and columns. During a card swipe, each magnetic sensor receives a series of readings. A processor determines relative bit rates for each series of readings. The processor determines which sensor corresponds to which track of the magnetic stripe based on a comparison of the relative bit rates. The processor generates a data stream for at least one track based on portions of readings from each sensor during periods of time the sensor is determined to correspond to the track.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for modulating card information between a card reader and a user device. One of the methods includes receiving, from a read head of the card reader, card information associated with a card. The card information is encoded in a first format to be sent to the user device at a first data rate. The card information is encoded in a second format to be sent to the user device at a second data rate lower than the first data rate. The card information is sent to the user device encoded in the first format and the second format.

Abstract: A technique for tamper protection in an electronic device is disclosed. A conductive mesh is affixed onto one or more interior surfaces of the outer housing of the device. The mesh includes one or more conductive traces coupled to one or more detectors within the device. The detector can detect an open-circuit or short-circuit condition resulting from an unauthorized attempt to open the housing, and output a signal to trigger an appropriate countermeasure. The electrical contacts along the trace that are monitored can be selected differently from one manufactured unit to the next, and can be selected based on a randomness function. The selection of contacts may be made during or after manufacturing of the device. The mesh can include multiple metal traces that run very close together, in parallel, across one or more interior surfaces of the housing, allowing detection of both open-circuit and short-circuit conditions.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for modulating card information between a card reader and a user device. One of the methods includes receiving, from a read head of the card reader, card information associated with a card. The card information is encoded in a first format to be sent to the user device at a first data rate. The card information is encoded in a second format to be sent to the user device at a second data rate lower than the first data rate. The card information is sent to the user device encoded in the first format and the second format.

Abstract: Aspects of the subject disclosure provide a card reader for receiving payment card information at a mobile point-of-sale terminal. In some implementations, a reader of the subject technology can include a memory, a conditioning module and a 3.5 mm audio plug including an audio bus that is configured for insertion into a headphone port of a host device, such as a smart phone or tablet computer. Implementations of the subject technology also include a microprocessor configured to perform operations for receiving a training sequence for use in determining communication parameters associated with a mobile device, and in response to the training sequence, transmitting an acknowledgement signal to the mobile device, via the audio bus, to indicate that a communicative coupling with the mobile device has been successfully established.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for modulating card information between a card reader and a user device. One of the methods includes receiving, from a read head of the card reader, card information associated with a card. The card information is encoded in a first format to be sent to the user device at a first data rate. The card information is encoded in a second format to be sent to the user device at a second data rate lower than the first data rate. The card information is sent to the user device encoded in the first format and the second format.

Abstract: A magnetic read head includes a plurality of pins; circuitry for converting magnetic signals to electrical signals, where output of the circuitry is coupled to the plurality of pins; and a shield that encloses the circuitry, the shield having a front face through which magnetic signals pass to read the magnetic stripe, a base on a side of the shield opposite the front face, and one or more side surfaces between the base and the front face, and wherein the shield has an opening for each pin of the plurality of pins, wherein each pin is configured to pass through a respective opening, wherein the plurality of openings are positioned on the one or more side surfaces of the shield, where each pin extends from the shield along an axis that is parallel to a plane defined by the base of the shield.

Abstract: A magnetic read head includes a plurality of pins; circuitry for converting magnetic signals to electrical signals, where output of the circuitry is coupled to the plurality of pins; and a shield that encloses the circuitry, the shield having a front face through which magnetic signals pass to read the magnetic stripe, a base on a side of the shield opposite the front face, and one or more side surfaces between the base and the front face, and wherein the shield has an opening for each pin of the plurality of pins, wherein each pin is configured to pass through a respective opening, wherein the plurality of openings are positioned on the one or more side surfaces of the shield, where each pin extends from the shield along an axis that is parallel to a plane defined by the base of the shield.

Abstract: A magnetic read head includes a plurality of pins; circuitry for converting magnetic signals to electrical signals, where output of the circuitry is coupled to the plurality of pins; and a shield that encloses the circuitry, the shield having a front face through which magnetic signals pass to read the magnetic stripe, a base on a side of the shield opposite the front face, and one or more side surfaces between the base and the front face, and wherein the shield has an opening for each pin of the plurality of pins, wherein each pin is configured to pass through a respective opening, wherein the plurality of openings are positioned on the one or more side surfaces of the shield, where each pin extends from the shield along an axis that is parallel to a plane defined by the base of the shield.

Abstract: The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. Edge metallization of the subassembly board can provide enhanced thermal or electrical connection to the underlying portions of one or more lugs.

Abstract: A semiconductor device has a semiconductor die (12) mounted to a leadframe (25). The semiconductor die is a power semiconductor device. A thermally conductive overmolding compound (22) is formed over the semiconductor die. The overmolding compound is made with a thermally conductive epoxy that conducts heat in the range of 2-5 watts/meter K. A pin-fin heat sink (24) is mounted to a top surface of the thermally conductive overmolding compound. The heat sink has a solid base (28) with a plurality of pin-fins (30) extending from the base. Scour lines (40) are cut in the base between the pin-fins. The heat generated by the semiconductor die is dissipated through the thermally conductive overmolding compound to the pin-fin heat sink.

Abstract: The invention provides arrangements to facilitate surface mounting of subassembly boards on a motherboard with reliable, high conductivity interconnection. In accordance with the invention, the subassembly interconnection arrangement is composed of separate power and sense connector arms formed on one or more base headers. The arrangement interconnects and supports the subassembly board on the motherboard surface. Each power arm advantageously comprises a plurality of split-based mounting lugs secured to the arm in a coplanar configuration. Each sense connector arm preferably comprises a plurality of connector pins secured to the arm in a coplanar configuration. Embodiments are disclosed for vertical and horizontal surface mounting.