Patents by Inventor Thomas Terrance LYNCH

Thomas Terrance LYNCH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220069067
    Abstract: In some examples, an integrated circuit comprises a substrate; a first metal layer and a second metal layer positioned above the substrate; a first composite dielectric layer located on the first metal layer, wherein the first composite dielectric layer comprises a first anti-reflective coating; a second composite dielectric layer positioned on the second metal layer, wherein the second composite dielectric layer comprises a second anti-reflective coating; and a capacitor metal layer disposed over the first composite dielectric layer.
    Type: Application
    Filed: October 13, 2021
    Publication date: March 3, 2022
    Inventors: Poornika FERNANDES, David Matthew CURRAN, Stephen Arlon MEISNER, Bhaskar SRINIVASAN, Guruvayurappan S. MATHUR, Scott William JESSEN, Shih Chang CHANG, Russell Duane FIELDS, Thomas Terrance LYNCH
  • Patent number: 11171200
    Abstract: In some examples, an integrated circuit comprises a substrate; a first metal layer and a second metal layer positioned above the substrate; a first composite dielectric layer located on the first metal layer, wherein the first composite dielectric layer comprises a first anti-reflective coating; a second composite dielectric layer positioned on the second metal layer, wherein the second composite dielectric layer comprises a second anti-reflective coating; and a capacitor metal layer disposed over the first composite dielectric layer.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: November 9, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Poornika Fernandes, David Matthew Curran, Stephen Arion Meisner, Bhaskar Srinivasan, Guruvayurappan S. Mathur, Scott William Jessen, Shih Chang Chang, Russell Duane Fields, Thomas Terrance Lynch
  • Publication number: 20210098565
    Abstract: In some examples, an integrated circuit comprises a substrate; a first metal layer and a second metal layer positioned above the substrate; a first composite dielectric layer located on the first metal layer, wherein the first composite dielectric layer comprises a first anti-reflective coating; a second composite dielectric layer positioned on the second metal layer, wherein the second composite dielectric layer comprises a second anti-reflective coating; and a capacitor metal layer disposed over the first composite dielectric layer.
    Type: Application
    Filed: September 26, 2019
    Publication date: April 1, 2021
    Inventors: Poornika FERNANDES, David Matthew CURRAN, Stephen Arlon MEISNER, Bhaskar SRINIVASAN, Guruvayurappan S. MATHUR, Scott William JESSEN, Shih Chang CHANG, Russell Duane FIELDS, Thomas Terrance LYNCH