Abstract: Processes for coating implantable medical devices that improve the stability of therapeutic agents contained within the coating.

Abstract: An apparatus which provides selectively either constant power, constant current or constant voltage to the heating elements of the thermods. The soldering system power supply apparatus includes devices for monitoring and controlling individual temperature profiles of each soldering thermod heating element. A computerized arrangement controls the power to each thermod in a very accurate manner. For the purpose of adjusting the power to each thermod element as a function of its temperature and the desired temperature profile, a set of temperature sensors are coupled to each of the thermod elements for measuring its temperature. Similarly, a set of energy sensors are also coupled to each of the thermod elements for detecting the amount of electrical energy supplied to each thermod.

Abstract: A tool changing system having high current surface mount tools, such as a hot bar reflow soldering head. The tool changing system includes a mounting fixture for connecting and disconnecting the surface mounting tool to a robotic unit. A low profile, small diameter robotic tool adaptor is utilized for coupling a variety of different types and kinds of robotic units to the surface mount tool and to reduce lead to pad misalignment problem caused by non-copolanarity between the mounting surface of the robotic unit and the working surface of the surface mount tool.

Abstract: A robotic controlled soldering apparatus is more precise in operation apparatus, and includes a protuberance and complementary shaped socket for defining a universal joint to provide a gimballing action to help prevent unwanted shift in the robotic control unit. A supply of fluid under pressure is directed between the pertuberance and the socket to reduce friction between their respective surfaces to reduce reaction on the delicate robotic arm as the head settles in place.

Abstract: A soldering system includes a visualization station disposed in relatively close proximity to the final resting position of a circuit element to be soldered, and a back lighted head arrangement for helping transport the circuit element to the visualization station, and for helping facilitate the clear visualization of the element so that its position may be adjusted for possible misalignment at the time of its placement at the final position.