Patents by Inventor Thomas TOLAND

Thomas TOLAND has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Processes, Systems and Devices for Metal-Filling of Open HTS Channels
    Publication number: 20240420875
    Abstract: Described are concepts, systems, structures and techniques for metal filling an open channel (12) in a baseplate (19). In embodiments, metal filling of an open baseplate channel is achieved using vacuum pressure impregnation (VPI). In embodiments, a compression plate (14a) is disposed over an open baseplate channel (12) to be filled with a molten metal. In embodiments, gaskets (97) are disposed between the compression plate (14a) and a surface of the baseplate (10) proximate the baseplate channel (12). In embodiments, a channel cap (26) is disposed over the open channel. In embodiments, the channel cap (26) has a solder flow channel (29, 32) provided in a surface thereof. In the embodiments, the solder flow channel (29, 32) has a meandering shape. In embodiments, a solder flow channel (29, 32?) is provided in the compression plate (14a) and/or the baseplate (10).
    Type: Application
    Filed: November 15, 2022
    Publication date: December 19, 2024
    Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLC
    Inventors: Amanda HUBBARD, Brian LABOMBARD, Richard MURRAY, James IRBY, Rui VIEIRA, William BECK, Thomas TOLAND, Vincent FRY, Shane SCHWEIGER, Amelia WATTERSON, Sarah CHAMBERLAIN, Jose ESTRADA, Theodore MOURATIDIS, Kenneth STEVENS
  • PROCESSES, SYSTEMS AND DEVICES FOR METAL FILLING OF HIGH TEMPERATURE SUPERCONDUCTOR CABLES
    Publication number: 20240290520
    Abstract: Techniques described herein relate to systems and methods for obtaining a high temperature superconducting (HTS) cable assembly and filling the HTS cable assembly with a molten metal, such as solder.
    Type: Application
    Filed: February 20, 2024
    Publication date: August 29, 2024
    Applicant: Massachusetts Institute of Technology
    Inventors: Amanda HUBBARD, James IRBY, Rui VIEIRA, William BECK, Richard MURRAY, Andrew PFEIFFER, Thomas TOLAND, William BURKE
  • Processes, systems and devices for metal filling of high temperature superconductor cables
    Patent number: 11948704
    Abstract: Techniques described herein relate to systems and methods for obtaining a high temperature superconducting (HTS) cable assembly and filling the HTS cable assembly with a molten metal, such as solder.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: April 2, 2024
    Assignee: Massachusetts Institute of Technology
    Inventors: Amanda Hubbard, James Irby, Rui Vieira, William Beck, Richard Murray, Andrew Pfeiffer, Thomas Toland, William Burke
  • PROCESSES, SYSTEMS AND DEVICES FOR METAL FILLING OF HIGH TEMPERATURE SUPERCONDUCTOR CABLES
    Publication number: 20220013256
    Abstract: Techniques described herein relate to systems and methods for obtaining a high temperature superconducting (HTS) cable assembly and filling the HTS cable assembly with a molten metal, such as solder.
    Type: Application
    Filed: November 12, 2020
    Publication date: January 13, 2022
    Inventors: Amanda HUBBARD, James IRBY, Rui VIEIRA, William BECK, Richard MURRAY, Andrew PFEIFFER, Thomas TOLAND, William BURKE