Abstract: In one particular embodiment, an integrated circuit includes a package and a substrate electrically and physically coupled to the package. The package includes a first pin, a second pin, and metallization coupling the first pin to the second pin. The substrate is coupled to the package via the first pin and the second pin. The substrate includes a plurality of power domains and a power control unit. The second pin of the package is coupled to a particular power domain of the plurality of power domains. The power control unit includes logic and a switch, where the switch includes a first terminal coupled to a voltage supply terminal, a control terminal coupled to the logic, and a second terminal coupled to the first pin of the package. The logic selectively activates the switch to distribute power to the particular power domain via the metallization of the package.

Abstract: A method comprises receiving a description of a power distribution network of a circuit, defining at least one DC supernode in the power distribution network, receiving a logical description of the circuit, and determining at least one logic path in the circuit. The method further comprises traversing the at least one logic path in reverse and determining at least one input vector of the at least one logic path. The input vector describes a plurality of nodes in the logic path and a logic transition at an output node occurring in response to a combination of logic transitions at at least one input node in the at least one logic path.